Sun Microsystems, Inc.

Dimitry Struve

William W Ruckman

Christopher H Frank

David J Kim

Jeffrey T Paladini

Philip G Yurkonis

Milton C Lee

James G Ammon

David K J Kim

Rack-mounted enclosure

Desktop tower enclosure

An enclosure includes a base having an interior volume and a first cover attachable to the base and adapted to cover a first portion of the interior volume of the base such that, with the first cover attached to the base, a second portion of the interior volume of the base is accessible. The enclosure further includes a second cover attachable to the base and adapted to cover a second portion of the interior volume of the base, wherein the first cover in combination with the second cover covers generally all of the interior volume of the base.

Side-accessible computer system enclosure and method

A bezel assembly for a computer enclosure includes a bezel and a hinge capable of hingedly joining the bezel to the computer enclosure. A computer system includes an enclosure, a bezel, and a hinge capable of hingedly joining the bezel to the enclosure. A method of replacing a first component with a second component in a computer system enclosure having a hinged bezel includes pivoting the hinged bezel away from the computer system enclosure and removing the first component from the computer system enclosure. The method further includes inserting the second component into the computer system enclosure and pivoting the hinged bezel toward the computer system such that the hinged bezel is adjacent the computer system enclosure.

Hinged bezel for a computer system

The present invention discloses improved cooling designs and methods for the cooling of heat sources. One embodiment of the present invention is a cooling system comprising a housing and at least one divider disposed within the housing. The at least one divider creates a plurality of airflow channels through the housing. Another embodiment of the invention is a method for dissipating heat from heat sources within an electrical assembly comprising at least partially separating the heat sources with a divider. Separate airflow channels are created whereby the separated heat sources are disposed within the separated airflow channels. Forced airflow streams are generated through the separated airflow channels, thereby dissipating heat from the heat sources into the forced airflow streams.

Method and apparatus for cooling electronic components

A fan assembly with a single fan housing that has at least one fan passage adapted to allow air to flow through the housing. A separate fan subassembly is snapped into a motor housing formed within the passages of the fan housing. The subassembly includes an electric motor that rotates an impeller. The rotation of the impeller creates an airflow through the air passage. Attached to the surface of the housing is a conductor that extends from the motor, to an electrical connector that supplies power to the motor from an external power source. The air passage has rounded entrances and is formed such that the passage is shaped like a venturi tube. The rounded edges reduce the head loss through the passage by an order of magnitude, decreasing the pressure drop across the housing and improving the overall efficiency of the fan.

Integrated forced convection air cooling systems

Growing community of inventors

Los Altos, CA, United States of America

Dimitry Struve