Mellanox Technologies, Ltd.

Yissum Research Development Company of the Hebrew University of Jerusalem Ltd.

Eth Zurich

Mellanox Technologies Silicon Photonics Inc.

Aristotle University of Thessaloniki

Dimitrios Kalavrouziotis

Elad Mentovich

Paraskevas Bakopoulos

Boaz Atias

Anna Sandomirsky

Yaakov Gridish

Dimitrios Syrivelis

Tamir Sharkaz

Donald Becker

Itshak Kalifa

Ioannis (Giannis) Patronas

Dazeng Feng

Wei Qian

Avraham Ganor

Sylvie Rockman

Nikolaos Argyris

Nikos Argyris

Wei Liu

Mehdi Asghari

Dotan David Levi

Louis Bennie Capps, Jr

Eitan Zahavi

Moshe Oron

Ran Ravid

Vladimir Iakovlev

Eyal Moshe Waldman

Joan Fong

Yuri Berk

Juan Jose Vegas Olmos

Xin Yin

Dan Mark Marom

Doron Naveh

Tali Septon

Eran Aharon

Adi Levi

Hanan Shumacher

Juerg Leuthold

Roee Shapiro

Nimer Hazin

James Stephen Fields, Jr

Nikolaos (Nikos) Argyris

Anders Larsson

Eilam Zigi Ben Smolinsky

Lion Bassat

Alon Rubinstein

Nimrod Rockman

Yoav Rosenberg

Filip Leonard Hjort

Giannis Poulopoulos

Attila Fulop

Hercules Avramopoulos

Yoav Rozenberg

Geert Van Steenberge

Anders Gösta Larsson

Rana Darweesh

Claudia Hoessbacher

Dimitrios Tsiokos

Jonathan Luff

Konstantinos Tokas

Prethvi Ramesh Kashinkunti

Julie Irene Marcelle Bernauer

An optoelectronic component may include a substrate, an electronic integrated circuit supported by the substrate, and a photonic integrated circuit supported by the substrate. The optoelectronic component may include a plurality of substrate interconnect connectors disposed on the substrate, a plurality of electronic integrated circuit interconnect connectors disposed on the electronic integrated circuit, and a plurality of photonic integrated circuit interconnect connectors disposed on the photonic integrated circuit. The optoelectronic component may include a first plurality of cable connectors, each cable connector connected to the substrate, the electronic integrated circuit, and the photonic integrated circuit via respective interconnect connectors. The first plurality of cable connectors may be configured to facilitate electrical communication between the substrate, the electronic integrated circuit, and the photonic integrated circuit. The first plurality of cable connectors may define a first layout, and an overall connectivity of the optoelectronic component may correspond to the first layout.

Optoelectronic component and method of manufacturing an optoelectronic component

Systems, computer program products, and methods are described herein for network discovery, port identification, and/or identifying fiber link failures in an optical network, in accordance with an embodiment of the invention. The present invention may be configured to sequentially connect each port of an optical switch to a network port of a server and generate, based on information associated with network devices connected to the ports, a network map. The network map may identify which network devices are connected to which ports of the optical switch and may permit dynamic port mapping for network installation, upgrades, repairs, and/or the like. The present invention may also be configured to determine a fiber link in which a failure occurred and reconfigure the optical switch to allow communication between an optical time-domain reflectometer and the fiber link to test the fiber link.

Systems and methods for identifying fiber link failures in an optical network

A light emitting device, a transmitter, and a silicon photonics chip, among other things, are disclosed. An illustrative light emitting device is disclosed to include a silicon substrate, a waveguide disposed on or integrated in the silicon substrate, where the waveguide includes a wide waveguide section at a first end and a narrow waveguide section at a second end, a first metal pad disposed over the wide waveguide section and at least partially across the first end of the waveguide, and a second metal pad disposed over the wide waveguide section, distanced away from the first metal pad. Electrical current passing between the first metal pad and the second metal pad may cause light to be produced in the wide waveguide section and the light produced in the wide waveguide section is at least partially reflected by the first metal pad and directed to the narrow waveguide section for transmission.

Light emitting silicon device

An optoelectronic device () includes thin film structures () disposed on a semiconductor substrate () and patterned to define components of an integrated drive circuit, which is configured to generate a drive signal. A back end of line (BEOL) stack () of alternating metal layers () and dielectric layers () is disposed over the thin film structures. The metal layers include a modulator layer (), which contains a plasmonic waveguide () and a plurality of electrodes (), which apply a modulation to surface plasmons polaritons (SPPs) propagating in the plasmonic waveguide in response to the drive signal. A plurality of interconnect layers are patterned to connect the thin film structures to the electrodes. An optical input coupler () is configured to couple light into the modulator layer, whereby the light is modulated by the modulation of the SPPs, and an optical output coupler () is configured to couple the modulated light out of the modulator layer.

Integrated plasmonic modulator

A transceiver module for providing operational resilience is presented. The transceiver module is configured to receive first data via a first optical module in a first configuration of operation and detect, using an adapter that is operationally connected to the first optical module, an operational failure of the first optical module. In response to detecting the operational failure, the transceiver module is configured to switch, via the adapter, from the first configuration of operation to a second configuration of operation by: automatically engaging a second optical module; triggering the first data that was initially directed into a first input port of the first optical module to be directed into a second input port of the second optical module; and receiving the first data from a second output port of the second optical module.

Transceiver module

An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode-transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non-linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.

Optical coupler

A semiconductor device assembly () includes a multi-layer printed circuit board (PCB—), a thermoelectric cooler (TEC—), a chip (), and packaged integrated circuitry (IC—). The multi-layer PCB includes a lateral heat conducting path () formed in a recessed area () of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink () in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.

Heat removal from silicon photonics chip using a recessed side-by-side thermal dissipation layout

Various embodiments provide methods for fabricating a couplable electro-optical device. An example method comprises fabricating a pillar on a substrate by forming a lens spacer portion about an electro-optical component fabricated on the substrate; and adhering unshaped lens material to an exposed surface of the pillar. The exposed surface of the pillar is disposed opposite the substrate. The example method further comprises maintaining the unshaped lens material at a reflow temperature for a reflow time to allow the lens material to reflow into a formed lens shape, and curing the lens material to form an integrated lens having the formed lens shape secured to the lens spacer portion and formed about the electro-optical component on the substrate.

Self-aligned integrated lens on pillar

An apparatus comprises a support structure and one or more first optical components on the support structure that communicatively couple with a first endpoint. The one or more first optical components are configured to output and receive optical signals that travel over a free space medium to establish a secure link between the first endpoint and a second endpoint.

Devices, systems, and methods for free space key exchange

Apparatuses, systems, and associated methods of manufacturing are described that provide a dynamic data interconnect and networking cable configuration. The dynamic data interconnect includes a substrate, transmitters supported on the substrate configured to generate signals, and receivers supported on the substrate configured to receive signals. The dynamic data interconnect further includes a number of connection pads that receive data cables attached thereto and a number of transmission lanes that operably couple the transmitters and receivers to the connection pads. The dynamic data interconnect further includes transmission circuitry in communication with each of the transmitters and receivers such that, in an operational configuration, the transmission circuitry determines a transmission state of the dynamic data interconnect and selectively disables operation of at least a portion of the transmitters or at least a portion of the receivers.

Dynamic bandwidth connections

Embodiments are disclosed for providing a serializer and/or a deserializer with redundancy using optical modulators. An example system includes an MZM structure that comprises a first waveguide interferometer arm structure and a second waveguide interferometer arm structure. The first waveguide interferometer arm structure comprises a first segmented electrode associated with at least a first electrode and a second electrode. The second waveguide interferometer arm structure comprises a second segmented electrode associated with at least a third electrode and a fourth electrode. The MZM structure is configured to convert an optical input signal into an optical output signal through application of a digital data signal to the first electrode and the third electrode, and application of a redundant digital data signal to the second electrode and the fourth electrode.

Serial data conversion redundancy using optical modulators

A multi-chip module (MCM-) includes a substrate (), one or more photonic chips () disposed on the substrate, and an electronic chip () disposed on the substrate. The one or more photonic chips include one or more optical channels (), which are configured to guide propagating optical signals, and two or more photonic modulator-segments () coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto. The electronic chip is configured to generate the digitally modulated driving electrical signals on multiple different lanes () of the electronic chip, synchronize the driving electrical signals on the multiple lanes to a same clock, separately control respective phases of the driving electrical signals, fine-tune the voltages of the driving electrical signals on the multiple lanes, and drive the photonic modulator-segments on the photonic chips with the synchronized and phase-controlled driving electrical signals.

Consolidating multiple electrical data signals into an optical data signal on a multi-chip module using ASIC for controlling a photonics transceiver

Embodiments are disclosed for a coupling element with embedded modal filtering for a laser and/or a photodiode. An example system includes a laser and an optical coupling element. The laser is configured to emit an optical signal. The optical coupling element is configured to receive the optical signal emitted by the laser. The optical coupling element is also configured to be connected to an optical fiber such that, in operation, the optical signal is transmitted from the laser to the optical fiber via the optical coupling element. Furthermore, the coupling element comprises a tapered section that provides modal filtering of the optical signal.

Coupling element with embedded modal filtering for a laser and/or photodiode

A photonics frequency comb generator includes two integrated dies: an indium phosphide die laser of a first wavelength is grown on from, and a silicon photonics die having a microring resonator connected to the laser and frequency modulators. The microring resonator converts the first wavelength into a number of second wavelengths. One type of the microring resonator is a hybrid non-linear optical wavelength generator, comprising non-silicon materials, such as SiC or SiGe built on silicon to yield a non-linear wavelength generation. The second wavelengths are generated by adjusting the ring's geometric size and a distance between the ring and the traverse waveguide. Another type of microring resonator splits the first wavelength into a plurality of second wavelengths and transmits the multiple second wavelengths to filters and modulators, and each selects and modulates one of the second wavelengths in a one-to-one relationship. This frequency comb generator has applications in WDM/CWDM and multi-chip modules in high speed transceivers.

Heterogeneous integration of frequency comb generators for high-speed transceivers

Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.

Optical components with reduced interference

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Papagou, Greece

Dimitrios Kalavrouziotis