Lear Corporation

Dilip Daftuar

Nadir Sharaf

Slobodan Pavlovic

Juan Lopez

David Menzies

Richard Joseph Hampo

Rutunj Rai

Ajmal Imran Ansari

Reshma Rathod

Venkat Rao Yalamanchili

George Kaminski

A heat conductor for use with an inverter in an electric or hybrid-electric vehicle, the inverter including a direct current link capacitor having multiple film capacitors configured in a stack to form a substantially polygonal prism. Each film capacitor has orthotropic characteristics. The heat conductor has a first substantially planar member configured to contact a first side of the polygonal prism formed by one of the film capacitors, and a second substantially planar member configured to contact a second side of the polygonal prism opposite the first side of the rectangular prism, the second side of the rectangular prism formed by another one of the film capacitors. The first and second planar member are thermally conductive for dissipating heat generated by the film capacitors, are attached by an interconnect, and have sufficient rigidity to confine expansion of the film capacitors across the thicknesses thereof.

Heat conductor for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)

A charger assembly is provided with a housing having a cavity with an opening. A cover is fastened to the housing for covering the opening. A heat transfer duct is mounted to the cover with an inlet end and an outlet end each extending through the cover. A plurality of heat sinks is mounted to the cover in contact with the heat transfer duct. A plurality of circuit board assemblies are each mounted to the cover in contact with the plurality of heat sinks.

Charger assembly with heat transfer duct

A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)

A coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The inverter includes a direct current (DC) link capacitor comprising multiple film capacitors configured in a stack. The coldplate includes a first portion configured for attachment to at least one electronic component, the first portion having a perimeter and for dissipating heat generated by the electronic component. The coldplate includes a second portion oriented along the perimeter of the first portion and forming a conduit, the conduit having a chamber extending from the perimeter of the first portion and between two of the plurality of film capacitors of the DC link capacitor. The conduit has an inlet and an outlet to facilitate circulation of a coolant through the chamber of the conduit for dissipating heat generated by the DC link capacitor.

Coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)

An electromagnetic interference shield assembly is provided with a first housing formed of a first conductive polymer. The first housing has a cavity sized to receive an electronic sub-assembly therein. A second housing is formed of a second conductive polymer. The second housing has a cavity sized to receive the first housing therein.

Charger assembly and electromagnetic interference shield assembly

A housing assembly to enclose an electrical subassembly includes a housing formed from a conductive polymer. The housing has a cavity sized to receive an electronic sub-assembly therein. A conductive boss is insert-molded into the housing in conductive contact with the housing. A conductive bracket is fastened to the boss in conductive connection with the boss and the housing to support and electrically ground the housing.

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West Bloomfield, MI, United States of America

Dilip Daftuar