Asml Holding N.v.

Silicon Valley Group, Inc.

Other

Asml Holdings N.v.

Asml Us, Inc.

Dikran S Babikian

Hilario L Oh

Bryan H Wade

Robert Parkash Mandal

Douglas S Bensley

John E Barney

Mark N Tanny

Branko Bem

Frank Dimaggio

Bryan Wade

Larry Stark

The present invention provides systems and methods of controlling local environment. In one embodiment, incoming air enters a contactor such the Direct Contact Cooler-Condenser (DCCC) where the air contacts water distributed on the contact media. After passing through the DCCC, the air is saturated at a temperature equal or close to that of the water. Depending on the state of the incoming air, in the DCCC will be humidified or dehumidified to yield saturated air at the desired humidity ratio. In one embodiment, a blower draws air through the DCCC and blows into the heater. The heater heats the air to the desired dry-bulb temperature. Before exiting, the air may pass through a filter.

Systems and methods for controlling local environment

Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.

Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems

A wafer cluster tool is described which operates in a regular, periodic fashion. Embodiments of the invention have a periodicity of one sending period. The invention enables the determination of pick-up times for process chambers in the cluster tool, and embodiments of the invention allow the creation and maintenance of an updated timetable. The timetable indicates times when each of the process chambers is to be serviced. These values are updated as the process chambers receive new wafers. Robots in the cluster tool may pre-position themselves in front of modules, or process chambers, to be served. Robot pre-positioning eliminates the wait time of individual modules beyond queue times which have been pre-determined for the modules. This renders the path of the individual robots pre-deterministic, and enables the cluster tool to utilize single gripper robots.

Robot pre-positioning in a wafer processing system

Methods and apparatus for controllably dispensing fluids within wafer track modules using rotatable liquid dispense arms and nozzles. The fluid dispense apparatus may be specifically selected for developing a photoresist-coated substrate. A series of one or more rotatable arms can be mounted adjacent to a mounted substrate within a develop module, wherein each arm supports a dispense nozzle that is connected to a fluid source. The dispense nozzle may be formed with a plurality of nozzle tips for dispensing selected developer and rinse fluids. Each rotatable arm can be configured to rotate about its longitudinal axis to selectively position the dispense nozzle between various dispense positions and non-dispense positions to reduce risk of dripping solution onto the substrate. Methods for developing photoresist-coated semiconductor wafers are also provided herein using developer and rinse fluid dispense apparatus with a dispense arm that is rotatable about its longitudinal axis. While in a dispense position, the arm or nozzle itself can be rotated so as to direct nozzle tips towards a wafer surface which facilitates fluid dispense onto the surface. While in the non-dispense position, the nozzle tips may be directed away from the wafer surface to reduce the likelihood of any undesired drips falling thereon.

Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms

This invention is a thermal management method for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The method integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal sink comprises a heat-carrying media with a controllable temperature. The wafer is heated from a first processing temperature to a second processing temperature during a heating time interval and then cooled to the first processing temperature from the second processing temperature during a cooling time interval. During heating and cooling, the wafer is constantly held in a fixed position. Zonal control of the thermal source and non-uniform flow of the thermal sink enable sensitive mitigation of thermal non-uniformity on a heating surface.

Method for substrate thermal management

The present invention describes systems and methods for exposure and removal of material on the periphery of a substrate. The system includes an emitting radiation or exposure source, preferably a guide such as an optical assembly and an emitter, an edge detector, a transport, which comprise rotating and radial mechanisms, and a substrate support. The optical assembly directs radiation from the exposure source to the wafer or emitter. The transport supports the emitter and the edge detector about the substrate, and a tracking exposure head preferably supports the emitter and edge detector. As the emitter moves along the periphery of the substrate, the edge detector sends signals to control systems, which process signals, and command the transport to adjust the position of the emitter when necessary to expose the periphery of the substrate. In another embodiment, the system provides an exposure source chamber, a process chamber, and optionally a control chamber to isolate particle and thermal problems. In another embodiment, the wafer is in a rotating drum, which supports a radial mechanism, supporting a tracking exposure head holding the emitter and edge detector. The drum and tracking exposure head have guidance components and stopping mechanisms.

Systems and methods for exposing substrate periphery

This invention is a substrate thermal management system for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The thermal management system integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal source includes a plurality of zones adapted to provide differing amounts of heat and a controllable temperature field over a surface proximal to the thermal diffuser. The thermal sink comprises a heat-carrying media with a controllable temperature.

Substrate thermal management system

The present invention provides systems and methods of dispensing liquids. In one embodiment, the system includes a pump with a removable pump module with at least one displacement piston and at least one piston valve. A motor and base assembly provide the supporting components of the pump which can be used in environments where precise small volumes of ultra-pure liquids must be transferred from a reservoir to a point of use. The preferred embodiment of the system prevents contaminants and air bubbles from being introduced into the liquid to be dispensed by placing a filter across the discharge line downstream from the pump, and providing a separate drawback line for performing the drawback of the liquid in the dispensing nozzle.

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Millbrae, CA, United States of America

Dikran S Babikian