Infineon Technologies Ag

Dietolf Seippel

Giuseppe Li Puma

André Hanke

Jens Kissing

Christian Grewing

Duyen Pham-Stäbner

Carsten Eisenhut

Nenad Stevanovic

An assembly includes a support element and a chip having contact elements. The chip is mounted onto the support element with the contact elements facing the support element. A shield layer is on the support element for electrically or magnetically shielding a circuit element of the chip.

Assembly comprising a support element and a chip, support element, method for shielding, and method for protecting

An assembly includes a substrate, a chip mounted on the substrate, a voltage controlled oscillator circuit including an inductor and further circuit elements. The inductor is mounted on or in the substrate, and the further circuit elements are mounted on or in the chip. An assembly is disclosed that includes a substrate including a first metallization plane and a second metallization plane, a chip mounted on the substrate, and an inductor mounted on or in the substrate. The inductor includes a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane. An assembly is also disclosed including a substrate, a chip mounted onto the substrate, and a transformer formed at least in part on or in the substrate.

Microchip assembly including an inductor and fabrication method

A first signal path having an amplifier and a second signal path having an amplifier with adjustable gain factor are provided. A signal applied to the first and second signal paths is amplified and demodulated on the first signal path. Concurrently, the signal is amplified on the second signal path with a gain factor, and a power of the signal amplified by the second signal path is determined and used for determining the gain factor. A signal conditioning circuit has first and second signal paths and a first and a second operating state. In the first operating state, the first signal path is arranged for amplification for a demodulation, and the second signal path is arranged for amplification for determination of a power of the signal present. In the second operating state, one of the two signal paths is inactive and the other is arranged for demodulating the signal present.

Signal processing method, particularly in a radio-frequency receiver, and signal conditioning circuit

A signal conditioning circuit contains an oscillator which is connected to the inputs of two mixers. The output of one mixer is coupled, so as to form a feedback path, to a frequency divider circuit whose first output is coupled to the second input of the first mixer. A second signal output of the frequency divider circuit carries a signal with a phase shift ofdegrees with respect to the signal at the first signal output of the frequency divider circuit. The second signal is supplied to a second input of the second mixer. Feedback results in undesirable signal components in the in-phase and quadrature components being suppressed. At the same time, the in-phase and quadrature components have a fixed phase relationship with respect to one another. The signal conditioning circuit allows desired non-integer division ratios to be achieved.

Signal conditioning circuit

One or more aspects of the present invention are directed to a frequency-doubling circuit arrangement that doubles the frequency of a signal applied to its input, and presents that doubled frequency signal at its output. A rectifier that rectifies the input signal as a function of a reference variable is provided for coupling the input and output. A regulator is used to supply the reference variable to a control input of the rectifier. A control loop is designed so that even-numbered higher harmonics in the output signal disappear or are greatly suppressed. Since the frequency-doubling circuit described has a low power consumption in conjunction with a smaller chip area, it is particularly suitable for installation in mobile radios for conditioning carrier frequencies and local oscillator frequencies.

Growing community of inventors

Bottrop, Germany

Dietolf Seippel