Infineon Technologies Ag

Dietmar Spitzer

Leo Aichriedler

Friedrich Rasbornig

Harald Witschnig

Peter Slama

Gaetano Formato

Tomas Manuel Reiter

Ramdas Ugale

Dirk Hammerschmidt

Tobias Werth

Helmut Koeck

Christoph Koch

Sebastian Maerz

Andrea Monterastelli

Theodor Kranz

Gerald Wriessnegger

Michael Ortner

Ramdas Rangnath Ugale

Patrik Holt Jones

Giampiero Ciammetti

A semiconductor module includes a semiconductor die, an encapsulation encapsulating the die, and first and second power contacts electrically coupled to the die. The power contacts each include an external part exposed from the encapsulation and an overlapping part. The power contacts are configured to carry respective first and second currents. A current flow of the first current in the external part of the first power contact points into or out of the semiconductor module. A current flow of the second current in the external part of the second power contact points in the opposite direction of the first current flow. The overlapping parts overlap such that the current flows point in the same direction in the overlapping parts. The overlapping parts include overlapping slots configured to accept a current sensor element for measuring a combined current in the overlapping parts.

Semiconductor module, method for fabricating a semiconductor module, and system

A power connector is provided that is configured to conduct a current. The power connector includes a base structure, an extension structure, and a connector head structure that define a current path for the current. The extension structure is coupled to and extends between the base structure and the connector head structure. The connector head structure includes a bore-hole that vertically extends into the connector head structure toward the base structure. The bore-hole is configured to receive a fastener for coupling the power connector to an electrical interface of a device. The connector head structure has a mechanical engagement feature configured to mechanically engage with a torque stabilization tool during a fastening of the fastener to the connector head structure in order to prevent a torque applied by the fastening of the fastener from being transferred to the extension structure.

Magnetic current sensor integration into high current connector device with mounting for torque stabilization

A system may include a busbar to conduct a current. The busbar may include a sensing structure. The system may include a magnetic sensor to sense a magnetic field produced by the current in the busbar. The magnetic sensor may be arranged near the sensing structure. The system may include a thermal element in or near the sensing structure. The thermal element may facilitate dissipation of heat through the sensing structure of the busbar.

Thermal element for a current sensing structure

A power electronics system includes: a power semiconductor module with opposite first and second sides and lateral sides connecting the first and second sides. The power semiconductor module includes: at least one power semiconductor die forming at least one part of a half bridge circuit, an encapsulation encapsulating the power semiconductor die, and an external contact configured as a current contact of the half bridge circuit and exposed from the encapsulation at a lateral side of the power semiconductor module. A driver module arranged over the first side of the power semiconductor module is configured to control the half bridge circuit. A differential Hall sensor arranged over the external contact is configured to detect a current in the external contact. The driver module is configured to modify a control pattern of the half bridge circuit based on a current value detected by the differential Hall sensor.

Power electronics system having a differential hall sensor, method of fabricating the power electronics system, and method of operating a power semiconductor module of the power electronics system

A power electronics system includes: a power semiconductor module with opposite first and second sides and lateral sides connecting the first and second sides. The power semiconductor module includes: at least one power semiconductor die forming at least one part of a half bridge circuit, an encapsulation encapsulating the power semiconductor die, and an external contact configured as a direct current contact of the half bridge circuit and exposed from the encapsulation at a lateral side of the power semiconductor module. A driver module arranged over the first side of the power semiconductor module is configured to control the half bridge circuit. A differential Hall sensor arranged over the external contact is configured to detect a direct current flowing through the external contact. The driver module is configured to modify a control pattern of the half bridge circuit based on a direct current value detected by the differential Hall sensor.

Power electronics system, method for fabricating a power electronics system and method for protecting a half bridge circuit from an overload or overcurrent

A power connector is provided that is configured to conduct a current and includes a conductive frame including a base structure, an extension structure, and a cap structure that define a current path for the current. The base structure is configured to be coupled to a current supply for receiving the current therefrom. The cap structure is configured to be coupled to an electrical interface of a device to be supplied with the current and outputs the current from the connector to the electrical interface of the device. The extension structure is coupled to and vertically extends between the base structure and the cap structure. The extension structure includes a current constriction region that is configured to cause a defined magnetic field of the current flowing through the current constriction region at a predefined position.

Magnetic current sensor integration into high current connector device

A power semiconductor module includes: an electrically insulative frame having opposite mounting sides and a border wall that defines a periphery of the frame; a substrate seated in the frame; power semiconductor dies attached to the substrate; signal pins attached to the substrate and electrically connected to the power semiconductor dies; a busbar attached to the substrate and extending through the border wall; a receptacle in the border wall configured to receive a current sensor module and that exposes part of the busbar, the exposed part of the busbar having an opening; and a rotation bar jutting out from a sidewall of the receptacle and onto the exposed part of the busbar without obstructing the opening in the busbar, wherein the rotation bar forms an axis of rotation within the receptacle. A power electronic assembly that incorporates the power semiconductor module and corresponding method of production are also described.

Power semiconductor module with current sensor rotation bar

A power connector is provided that is configured to conduct a current. The power connector includes a base structure, an extension structure, and a connector head structure that define a current path for the current. The base structure is coupled to an output node of a primary conductor and receives the current from the primary conductor. The connector head structure is configured to output the current from the power connector to the load. The extension structure is coupled to and extends between the base structure and the connector head structure. The extension structure includes a current constriction region configured to increase a magnetic flux density of a magnetic field produced by the current flowing through the current constriction region at a position of a magnetic current sensor that generates a sensor signal based on the magnetic field magnetic field produced by the current flowing through the current constriction region.

A busbar for current transport comprises conductive material, which extends along a current direction. A recess for a magnetic field sensor extends into the conductive material, a middle of the recess being shifted by a predetermined distance from a middle of the conductive material in the direction of an edge of the conductive material, so that, within a frequency range, a frequency dependency of a magnetic field, which is induced by an alternating current flowing along the current direction, is reduced in comparison with a busbar having a central recess.

Busbar and power module with busbar

A sensor device is provided with a magnetic field sensitive element being positioned in a magnetic field of a magnet. The magnetic field sensitive element is configured to sense an orientation angle of the magnetic field in the range between 0&#xb0; and 360&#xb0; and generate a sensing signal. The electronic circuitry is configured to receive and process the sensing signal from the magnetic field sensitive element to generate an angle signal indicating the orientation angle of the magnetic field and an angular speed of the shaft.

Angle based speed sensor device

A system is provided with a magnetic field sensor being positioned in a magnetic field of a magnet that is coupled to a rotatable driving shaft. The magnetic field sensor is configured to sense a rotation of the magnetic field in response to a rotation of the rotatable driving shaft, and generate an angle sensor signal based on an orientation angle of the magnetic field. The angle sensor signal includes angular values that represent an absolute orientation angle of the rotatable driving shaft. The system includes a memory storing a mapping of values of a patterned signal to the angular values, electronic circuitry configured to generate, based on the angular values and the stored mapping, the patterned signal, and a signal generator circuit configured to generate a signal representing the absolute orientation angle of the rotatable driving shaft based on the angle sensor signal.

Rotation sensor

A power connector is provided that is configured to conduct a current. The power connector includes a conductive frame including a base structure, an extension structure, and a cap structure that define a connector volume. The base structure is coupled to an output node of a primary conductor and receives the current from the primary conductor. The cap structure is configured to mechanically couple the power connector to a load and outputs the current from the power connector to the load. The extension structure is coupled to and extends between the base structure and the cap structure. The extension structure includes a current constriction region configured to cause a defined magnetic field of the current flowing through the current constriction region at a position of a magnetic current sensor that generates a sensor signal based on the defined magnetic field produced by the current flowing through the current constriction region.

A sensor device is provided with a magnetic field sensitive element being positioned in a magnetic field of a magnet. The magnetic field sensitive element is configured to sense an orientation angle of the magnetic field in the range between 0&#xb0; and 360&#xb0; and generate a sensing signal. The electronic circuitry is configured to receive and process the sensing signal from the magnetic field sensitive element to generate an angle signal indicating the orientation angle of the magnetic field.

A sensor device is provided with a magnetic field sensitive element being positioned in a magnetic field of a magnet. The magnet is positioned on an end face of a shaft. The magnetic field sensitive element is configured to sense an orientation angle of the magnetic field in the range between 0&#xb0; and 360&#xb0;. The shaft is one of a shaft of a transmission of a vehicle or a shaft of a brushless DC motor or a shaft of a wheel axle of a vehicle.

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Voelkermarkt, Austria

Dietmar Spitzer