Robert Boschgmbh

Dietmar Schnepf

Willi Gansert

Heiko Gruner

Dietrich Bergfried

Harry Slansky

Eduard Lochbrunner

Friedrich Vogel

Klaus Reindl

Jean Dorkel

Gert Heinrich

Eberhard Pfluger

A pure aluminum outer layer is provided to facilitate bonding with aluminum bonding wires having a diameter of 50 .mu.m or greater without formation of troublesome slivers upon bonding. Beneath that a copper-bearing aluminum layer with 1 to 4% copper content is provided. A third layer beneath the copper-bearing layer containing up to 1% silicon can be added below the copper-bearing layer to promote adhesion at contact window edges.

Semiconductor electric circuit device with plural-layer aluminum base

A multi-phase generator has a separately excited shunt field which is controlled by a voltage regulator. A free-wheeling diode is connected in parallel with the field. The voltage regulator is included in a single, hermetically sealed housing which has a metal base plate forming one terminal of the voltage regulator; two insulated terminals project from the voltage regulator and are sealed, in insulated relation, through the housing, preferably the base plate. Three monolithic semi-conductor integrated circuit (IC) chips are located within the sealed housing, two of them soldered to the base plate so that one of the semi-conductor connections of the chip are directly connected to the base plate, the connection being for the collector of the power transistor and the anode of the free-wheeling diode, the control portion of the voltage regulator being secured to a ceramic plate which is attached to the base plate, other terminals from the voltage regulator are being effected internally, by bonding wires, and to the two externally excessible contacts, so that the entire assembly is simple, readily manufactured, and requires little assembly, labor and time for connection to an alternator structure.

Solid state voltage regulated automotive-type electrical power supply

An insulating cover forms two wiring cavities over a heat-sink base plate, between which cavities a conductor pattern plate mounted on the base plate extends. The cover also provides an integral connector shell. The larger part of the base plate is within a first wiring cavity in which circuit components are mounted on the base plate and bonded by wires to the conducting pattern plate. The second wiring cavity encloses contact springs affixed to the connector means and soldered to the pattern plate and this cavity is closed off with a cover plate that snaps into place. The protection so provided for the apparatus is adequate for the conditions in a motor vehicle engine compartment.

Protectively covered mounting for a plug-in electronic apparatus of a

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Esslingen, Germany

Dietmar Schnepf