Ceramtec Gmbh

Dietmar Jähnig

Alexander Dohn

Roland Leneis

Klaus Herrmann

Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with Nwhile controlling oxygen at 0-50 ppm O, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with Nwhile keeping the oxygen content at 0-50 ppm O.

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Bindlach, Germany

Dietmar Jähnig