Continental Teves, Ag and Company Ohg

Continental Automotive Gmbh

Schaeffler Technologies Ag & Co .kg

Continental Automotive France

Conti Temic Microelectronic Gmbh

Continental Automotive Technologies Gmbh

Dietmar Huber

Jakob Schillinger

Lothar Biebricher

Stefan Günthner

Thomas Fischer

Michael Schulmeister

Svenja Raukopf

Manfred Goll

Edmond De Volder

Martin Watzlawik

Andreas Doering

Georg Weber

Henryk Frenzel

Stephan Risch

Hilmar Müller

Martin Throm

Frank Grunwald

Marco Benner

Karl-Heinz Scherf

Jens Heim

Klaus Rink

Wolfgang Jöckel

Franz Foerg

Martin Haverkamp

Lothar Weichenberger

Ulrich Schrader

Matthias Viering

Wilfried Babutzka

Günther Romhart

Dirk Theobald

Hervé Contet

Joachim Hrabi

Gúnter Fendt

Jörg Möstl

Joerg Moestl

Waldemar Baumung

Andreas Döring

Stefan GÜNTHNER

A potted electronic module includes an electronic assembly with a conductor such as a shunt that is arranged in a housing, and includes an electrical contact guided out through the housing wall, and a potting compound within the housing. The module may be produced by removing a protective layer from an area of the conductor by ablation, and then introducing a potting or casting compound into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.

Potted electronic module with improved adhesion of potting compound

A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

Structure-borne noise decoupling on sensors working with transmitter fields

A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Sensor production by holding the intermediate injection-molded part

A method for establishing a plug connection, and a method for strengthening a plug connection, wherein a connecting zone is welded with a laser beam which passes through a surrounding housing owing to transparency.

Method for producing a plug connector, method for amplifying a plug connector and device

A method for producing, on a metal retainer plate, an electronic module undergoing an electrical test. Prior to a final overmolding that forms the exterior envelope of the electronic module, there is performed a limited initial overmolding of at least one electrical-connection zone, thus surrounding a free-end portion of a rough form of an insulating second securing bar, by establishing between these a non-conducting overmolded bridge, a first securing bar is cut off from a component or element in order to electrically isolate said at least one electrical-connection zone, and an electrical test is performed on the zone prior to the final overmolding of the exterior envelope, with the electronic component or element being secured to the insulating second securing bar and to the retainer plate by the overmolded bridge.

Method for producing at least one electronic module on a metal retainer plate, including at least one electrical test

A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.

Sensor element for a motor vehicle

The sensor for detecting the position of a generator element which outputs a position-dependent physical variable, the sensor includes a transducer for converting the physical variable into an electric generator signal, a circuit on a wiring support for receiving the generator signal from the transducer and outputting a measurement signal that corresponds to the generator signal and a protective compound which at least partially surrounds the transducer and the wiring support, thus retaining the transducer on the wiring support.

Protective compound-enveloped sensor for detecting the position of an encoder element

The invention relates to a method for producing a connecting element, wherein electrical connections are defined by selective stamping-out. The invention further relates to a connecting element produced in this way and to a sensor arrangement having a connecting element of this kind.

Method for the production of a connecting element, connecting element, and sensor arrangement

A conductor track which is designed in particular for use with ultrasonic welding. The invention also relates to an associated method and to an associated use.

Electric conductor track, method, and use

A method for producing a coil as a measurement transmitter for a sensor, including: providing electrical connections and a magnetic core for the coil, forming a coil former around the magnetic core in such a way that the magnetic core is at least partially enclosed by the coil former and the electrical connections are held by the coil former, winding at least one coil wire onto the formed coil former, and connecting the wound coil wire to the electrical connections.

Method for producing a coil as measuring pickup for a sensor

A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.

Method for encasing an electric unit and electrical structural element

A method for producing a sensor includes a circuit carrier which includes an assembly island which supports a sensor circuit for emitting a sensor signal dependent on a physical transmitting field, and an interface which is electrically connected to the assembly island and which transmits the sensor signal to a superordinate signal processing device. The method includes: Enveloping one part of the circuit carrier containing the assembly island and the sensor circuit in a first protective compound; connecting a signal transmission element to the interface; enveloping at least one part of the first protective compound and the interface to at least one part of the signal transmission element connected thereto in a second protective compound.

Neutral part for a client-specific adaptable sensor

An electronic device including: an electronic circuit accommodated in a circuit housing having a first thermal expansion coefficient, and a molded body which surrounds the circuit housing, the body having a second thermal expansion coefficient that differs from the first thermal expansion coefficient. The molded body is fixed to the circuit housing at least at two different mutually spaced fixing points on the circuit housing.

Electronic device and method for producing an electronic device

A method is provided for producing an electronic module that includes an electronic assembly with a conductor which is arranged in a housing, and which includes an electrical contact guided out through the housing wall. In the method, a protective layer is removed from an area of the conductor by ablation, and then a potting or casting compound is introduced into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.

Method of producing a potted electronic module

A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: &#x2014;arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and &#x2014;encapsulating the electronic component with the encapsulation material.

Growing community of inventors

Rödermark, Germany

Dietmar Huber