Infineon Technologies Ag

International Business Machines Corporation

Altis Semiconductor

Qimonda Ag

Altis Semiconductor, Snc

Dietmar Gogl

Stefan Lammers

John Kenneth DeBrosse

Hans-Heinrich Viehmann

Martin Freitag

William Robert Reohr

Heinz Hoenigschmid

Ulrich Karl Klostermann

Thomas Roehr

Heinz H&ouml;nigschmid

Thomas R&ouml;hr

Thomas B&ouml;hm

Daniel Braun

Helmut Kandolf

Gerhard M&uuml;ller

Hans Viehmann

Roy E Scheuerlein

Till Schloesser

Rainer Leuschner

Till Schl&ouml;sser

Thomas Boehm

According to one embodiment of the present invention, an integrated circuit includes a plurality of thermal selectable memory cells, each memory cell being connected to a conductive line, the conductive line having a first portion for applying a heating current, and a second portion for applying a programming current. The integrated circuit is configured such that the heating current and the programming current can be routed respectively to the first and the second portion of the conductive line independently from each other.

Integrated circuit, memory cell array, memory module, and method of operating an integrated circuit

An integrated circuit has a current sense amplifier that includes a voltage comparator having a first input, a second input and an output; a first clamping device coupled between the first input of the voltage comparator and a first input signal node, a second clamping device coupled between the second input of the voltage comparator and a second input signal node, a current mirror having a first side and a second side, the current mirror first side including a first transistor coupled between a voltage source and the first clamping device and the current mirror second side including a second transistor coupled between the voltage source and the second clamping device, and a sensing scheme including an actively balanced capacitance coupled to the source and drain of the second transistor.

Integrated circuit, method of operating an integrated circuit, method of manufacturing an integrated circuit, memory module, stackable memory module

A design for a memory array that uses bi-directional write currents and that avoids switched ground connections for memory cells, thereby reducing signal loss and noise problems is described. Positive and negative current sources are provided to supply the bi-directional current that is used to write to a memory cell. These current sources may be selectively connected to bit lines that are electrically connected to the memory cells. Applying a positive current, from the positive current source, through a memory cell writes a '1', and applying a negative current, from the negative current source, through a memory cell writes a '0'. Use of both a positive and a negative current source enables writing to the memory cells without relying on a switched ground connection to provide bi-directional current. This permits a ground connection of each memory cell to be connected to a fixed ground. An example in which this design is used with a spin injection magneto-resistive random access memory (MRAM) device is shown.

Memory write circuit

A method for controlling the constant power dissipation of a memory cell includes initially measuring the resistance of the memory cell, and subsequently controlling a source to apply a variable level of current or voltage to the memory cell. The variable level of the applied current or voltage is determined in proportion to the measured resistance of the memory cell so as to result in a predefined level of power dissipation within the memory cell, said dissipated power operable to heat the memory cell.

System and method for controlling constant power dissipation

A memory with memory cells, wherein a memory cell includes a resistive element and a switch, wherein the memory cells are connected with a common plate line and with respective bit lines, wherein the common plate line supplies a plate voltage, wherein the switches include control inputs that are connected with word lines for controlling the switching states, wherein the word lines are connected with a word line driver that supplies selected word lines with a voltage, wherein the bit lines are connected with second switches, wherein the first bit lines are connectable by respective second switches with a first voltage level and the second bit lines are connectable by respective second switches with a second voltage level, wherein a first and a second bit line are connectable as a bit line pair with a sense amplifier, wherein the sense amplifier amplifies a voltage difference between the first and the second bit line of the bit line pair, wherein the resistive element is able to change the resistance depending on an electrical voltage that is applied across the resistive element, and wherein the second voltage level is between the plate voltage level and the first voltage level.

Memory device and method for reading data

A magnetic memory is disclosed. In one embodiment, the magnetic memory array includes a plurality of cell columns and a pair of reference cell columns, including a first reference cell column and a second reference cell column. A comparator is provided with a first and a second input terminal. A switching circuit is configured to connect each of the cell columns to the first input terminal and the pair of reference cell columns coupled in parallel to the second input terminal, and configured to connect the first reference cell column to the first input terminal and the second reference cell column to the second input terminal.

Magnetic Memory Array

A high-speed current sense amplifier has complementary reference cells and load devices that eliminate capacitive mismatch contributions. The current sense amplifier includes a voltage comparator, a first clamping device coupled between a first input of the voltage comparator and a first input signal node. The first clamping device is coupled to a reference voltage. A second clamping device is coupled between the second input of the voltage comparator and a second input signal node. The second clamping device is also coupled to the reference voltage. A current mirror is coupled between the first and second input of the voltage comparator and is coupled to an active capacitance balancing circuit. The active capacitance balancing circuit may be combined with the voltage comparator. Equalization devices may be coupled between the first and second inputs of the voltage comparator, and between the first input signal node and the second input signal node.

Current sense amplifier

A calibrated magnetic random access memory (MRAM) current sense amplifier includes a first plurality of trim transistors selectively configured in parallel with a first load device, the first load device associated with a data side of the sense amplifier. A second plurality of trim transistors is selectively configured in parallel with a second load device, the second load device associated with a reference side of the sense amplifier. The first and said second plurality of trim transistors are individually activated so as to compensate for device mismatch with respect to the data and reference sides of the sense amplifier.

Method and apparatus for current sense amplifier calibration in MRAM devices

An MRAM memory chip includes a plurality of magnetoresistive memory cells each including a magnetic tunnel junction having first (fixed) and second (free) magnetic regions, where the second magnetic region includes at least two ferromagnetic layers that are antiferromagnetically coupled, wherein a coil surrounds the memory chip for creating a magnetic offset field. Further, a method of writing to an MRAM chip includes bringing the memory cells into an active state exhibiting a reduced switching field before writing thereto and bringing the memory cells into a passive state exhibiting enlarged switching field after writing thereto.

MRAM with coil for creating offset field

A current sense amplifier including clamping devices and a current mirror is configured to sense the resistance of an MTJ memory cell utilizing a bitline boost circuit to shorten the charging time for parasitic circuit capacitance. The bitline boost circuit includes a source follower coupled to a reference voltage and a switch coupled to another voltage source. The switch is enabled to conduct during an initial period of sensing the resistance of the memory cell. The source follower in the bitline boost circuit is configured to clamp the voltage of an input signal at substantially the same level as the clamping devices, and to provide additional current to shorten the period for charging parasitic capacitance. The resulting current sense amplifier can be used to implement a memory device with fast and reliable read times and low manufacturing cost.

Sense amplifier bitline boost circuit

A magneto-resistive random access memory (MRAM) array comprises global bit lines segmented using a plurality of local bit lines. A read/write controller is connected to the switches. Switches couple the global bit line to the local bit lines. The MRAM array has low leakage currents and facilitates a high signal-to-noise (S/N) ratio of read and write operations.

MRAM array having a segmented bit line

A symmetrical high-speed current sense amplifier having complementary reference cells and configurable load devices that eliminates architecture-related capacitive mismatch contributions. The current sense amplifier is adapted for use in a symmetric sensing architecture and includes a configurable load device. The current sense amplifier includes a voltage comparator, a first clamping device coupled between a first input of the voltage comparator and a first input signal, the first clamping device being coupled to a reference voltage. A second clamping device is coupled between the second input of the voltage comparator and a second input signal, the second clamping device being coupled to the reference voltage. The load device may comprise a current mirror that is coupled between the first and second input of the voltage comparator. The current mirror may be configurable by select transistors. Alternatively, the load device may be a hard-wired current mirror, and a multiplexer may be used to select whether the first input signal or the second input signal is connected to a first or second side of the current mirror. Configurable dummy loads may be added at appropriate nodes to optimize the capacitive load and increase the speed of the amplifier. Equalization devices may be coupled between the first and second inputs of the voltage comparator, and between the first input signal and the second input signal.

A memory device includes a magnetic tunnel junction memory cell having a magnetic tunnel junction structure and a read switch. In one example, the read switch is connected to a conductor that is used to write to the magnetic tunnel junction structure. In a further example, the read switch is a transistor electrically coupled to the magnetic tunnel junction structure by a deep via contact. In a further example, the memory device includes a plurality of magnetic tunnel junction memory cells and a plurality of conductors respectively associated with the cells for writing information to the associated magnetic tunnel junction structures. Each read switch is connected to the conductor associated with a magnetic tunnel junction cell other than the cell in which the read switch resides.

Magnetic tunnel junction memory cell architecture

A memory sense amplifier for a semiconductor memory device is provided with a compensation current source device that generates a compensation current and feeds it to an interconnected bit line. The compensation current is selected in such a manner that during readout a potential gradient can be generated and/or maintained in cooperation with a compensation voltage source device on the selected and interlinked bit line device that is substantially constant over time.

Sense amplifier configuration for a semiconductor memory device

A memory matrix has at least one cell array including column lines and row lines. Memory elements are situated at points where the row lines and column lines intersect one another. In each case two adjacent lines are guided such that they cross one another in such a way that the two lines change their spatial configurations in sections along the direction in which they run. Thus an overcoupling of signals between the lines is minimized.

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Essex Junction, VT, United States of America

Dietmar Gogl