Endress + Hauser Gmbh + Co. Kg

Endress+hauserse+co. Kg

Other

Dietmar Birgel

Sergej Lopatin

Elke Maria Schmidt

Andreas Rossberg

Romuald Girardey

Alexander Müller

Marc Baret

Wolfgang Brutschin

Peter Klöfer

Bernd Strütt

Roland M&uuml;ller

Andrea Berlinger

Karl-Peter Hauptvogel

Armend Zenuni

Thomas Malzahn

Christoph Hippin

Alexander Bannwarth

Silke Czaja

Paul Burger

Franz Glatz

Michael Feucht

Joachim Oschwald

Alexander MÜLLER

An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

Component that can be soldered in SMD technology and method for producing a component that can be soldered in SMD technology

Disclosed is a method for producing a high-temperature-resistant, lead-free solder joint between a circuit board and a part, wherein a lead-free solder preform is used that has a composite material having a first composite component arranged substantially in layers and wherein the part is soldered with the solder preform in a hot-bar selective soldering process. Also disclosed is a high-temperature-resistant, lead-free solder joint and a field device of automation technology for determining and/or monitoring the process variable of a medium with a high-temperature-resistant, lead-free solder joint.

Method for producing a high-temperature resistant lead free solder joint, and high-temperature-resistant lead-free solder joint

The present disclosure relates to a method for positioning at least two circuit boards in a housing having a non-conductive surface, a first securement location for securing the first circuit board, and a second securement location for securing the second circuit board, wherein at least one conductive trace is arranged in the housing and is connected non-releasably with the housing, and wherein the conductive trace electrically contacts the first securement location with the second securement location, the method comprising securing the circuit boards in the securement locations of the housing such that the first circuit board is electrically in contact with the first securement location and the second circuit board is electrically in contact with the second securement location, wherein the first circuit board and the second circuit board are electrically in contact with one another via the at least one conductive trace.

Method for positioning circuit boards and circuit board arrangement

A method for connecting a component to a support via soldering between a first contact surface of the component and a second contact surface of the support. The method is distinguished by features including that at least one spacer is embodied in such a manner and arranged between the first contact surface and the second contact surface that the first contact surface and the second contact surface are spaced from one another, and that the soldering is executed in such a manner that the component and the support are connected with one another via the first contact surface and the second contact surface. Also claimed is a component connectable with a support via soldering is intended.

Method for connecting a component to a support via soldering and component connectable with a support

A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at least one internally situated conductor path, a first insulating layer arranged on a first surface of the circuit board, a second insulating layer arranged on a second surface of the circuit board, a first contact location at which the conductor path is accessible, a second contact location, at which the conductor path is accessible through a bore passing completely through the circuit board, and an electronic component arranged on the first surface. The component has a first contact surface, which is connected with the first contact location by solder or electrically conductive adhesive, and a second contact surface which is connected with the second contact location by solder or adhesive.

Circuit board with at least one electronic component

An electromechanical transducer with at least one piezoelectric element with a first surface on which a first electrode is applied, and at least one contact flag, through which the piezoelectric element is electrically connected. The electrical connection of the piezoelectric element is of very high contact reliability, in that the contact flag directly contacts the first electrode and exhibits at least one depression, into which an adhesive is placed, by which the contact flag is connected with the electrode.

Electromechanical converter comprising at least one piezoelectric element

The invention relates to an electromechanical transducer that is easy and inexpensive to produce. The inventive transducer comprises stacked piezoelectric elements between which contact electrodes (G, S, E) are interposed via which the piezoelectric elements are electrically connected. The contact electrodes (G, S, E) are configured as planar terminal lugs that are connected to the outside from a flexible printed board.

Electromechanical transducer

A circuit board with a contact sleeve mounted thereon. The contact sleeve is electrically connectable in the manner used for an SMD-component. An upper side of the circuit board has a recess and a metallizing bordering the recess, the metallizing being connected to a conductor path extending on the circuit board, and, set in the recess, a contact sleeve, which is both mechanically secured and electrically connected to the metallizing by means of a solder connection.

Printed circuit board comprising a contact sleeve that is mounted thereon

This circuit board contains electronic components having electrical contacts. At least one of the electrical contacts is initially glued to the circuit board using a conductive adhesive and at least one of the electrical contacts is connected to the circuit board by soldering. The circuit board is suitable for fast mechanical mass production. Further a method for the manufacture of the connection between the circuit board and the electronic components is disclosed, in which a solder is applied to soldering points and a conductive adhesive is applied to adhesive points. The circuit board with the components is then placed in a furnace to connect the components to the circuit board.

Circuit board with an electronic component and a method for producing a connection between the circuit board and the component

The invention relates to a device (,) for determining the filling level in a container (,). Moreover, the invention also relates to a method for fastening an input coupling unit (,) on the antenna (,), the antenna (,) being used in the device (,) according to the invention. It is the object of the invention to provide overvoltage protection for an antenna (,), and a method for producing such an antenna (,). The object is achieved by virtue of the fact that the antenna (,) comprises at least two dielectric layers (,). The first dielectric layer (,) has at least one cutout (,) for holding the input coupling unit (,). The second dielectric layer (,) bears an antenna structure (,) on the side facing the first dielectric layer (,) and has a conductive coating (,) with openings (,) on the side averted from the first dielectric layer (,). Contacts (,) are provided in the second dielectric layer (,) and the conductive layer (,) which connect the input coupling unit (,) to the conductive coating (,). The region of space defined by the contacts (,), the conductive coating (,) and the antenna housing (,) forms a Faraday cage.

Growing community of inventors

Schopfheim, Germany

Dietmar Birgel