Robert Boschgmbh

Dieter Seipler

Botho Ziegenbein

Susumu Nishigaki

Martin Holland

Walter R&ouml;thlingsh&ouml;fer

Bernd Schumann

Jiri Marek

Bernd Maihoeffer

A method for a parallel manufacturing of a plurality of piezoelectric actuators and a corresponding piezoelectric actuator utilize a plurality of thin foils composed of an unfired piezoelectric ceramic material which stacked one over another. On surface of foils, an electrode is provided for each actuator. For contacting electrodes, first and second connecting openings are provided. Electrodes have cut-outs which surround either first or second connecting openings. An electrically conductive paste is introduced into connecting openings. The stacked arrangement is fired and split up into the individual actuators. As internal electrodes, the electrodes are insulated from the surroundings.

Method for manufacturing piezoelectric actuators and a piezoelectric actuator

A sensor for the monitoring of an NO catalyst having a storage material for the adsorption of NO , the storage material forming the sensitive element of the sensor. As a result, it is possible to measure the instantaneous degree of charging of the storage material, and a quasi-linear control for the storage of NO is made possible. The ability to precisely monitor the degree of charging of the storage material makes it possible to better utilize the storage capacity, and the catalyst can be dimensioned in a more cost-effective manner. The conversion phase of the rich side can be predicted more precisely and consequently be integrated more favorably into the driving cycle. The sensor for the monitoring of an NO catalyst is especially suitable for installation in the exhaust path of an internal combustion engine with direct gasoline injection or of a diesel engine.

Sensor for the monitoring of an NOx catalyst

A method for a parallel manufacturing of a plurality of piezoelectric actuators and a corresponding piezoelectric actuator utilize a plurality of thin foils composed of an unfired piezoelectric ceramic material which are stacked one over another. On surface of foils, an electrode is provided for each actuator. For contacting electrodes, first and second connecting openings are provided. Electrodes have cut-outs which surround either first or second connecting openings. An electrically conductive paste is introduced into connecting openings. The stacked arrangement is fired and split up into the individual actuators. As internal electrodes, the electrodes are insulated from the surroundings.

Method for the production of piezoelectric actuators

Measuring cell for use with a sensor for measuring the mixture ratio of

A thick film hybrid arrangement has a plurality of ceramic foils provided with conductor paths and superimposed over one another, a support for supporting the ceramic foils, and a plurality of thin metal lugs located between the ceramic foils for contacting the conducting paths. The metal lugs extend outwardly beyond at least the ceramics foils so as to form outer contacts.

Thick film hybrid arrangement with outer contacts

Acceleration pick-up

To adhere a semiconductor chip or wafer substrate (10) to a carrier plate substrate (11) of, for example, ceramic, glass or the like, in which the two substrates carry exposed connection pads (13, 16), at least one of the substrates is coated with an adhesive electrically insulating, normally tacky material, which is exposed, by photo-masking technology, in all areas except those where the pads are located, to cure the material. Metallic powder, typically silver, is then introduced into the remaining tacky portions of the layer, to render it conductive, and the two substrates are then pressed against each other, with the pads in alignment, the metal powder within the tacky insulating material forming an electrical connection between said pads. The insulating layer can be applied either to the semiconductor chip or wafer substrate or to the carrier plate substrate, or to both. Electrical connecting lines to the pads, on the surface of one of the substrates, are covered by the then cured electrical insulating layer. Preferably, the surface, and the connecting lines thereon, if used, are passivated before application of the adhesive layer which, then, is cured, except in the location of the pads.

Method of electrically and mechanically connecting a semiconductor to a

An acceleration pickup for releasing occupant protecting devices in power vehicles has a housing, a ceramic plate which acts as a bending spring and is clamped at its one end in the housing, and expansion-sensitive resistances arranged in the ceramic plate. The housing is composed of several layers of ceramic structural parts and is produced by a thick film technique.

Acceleration pickup

Multiple-plate hybrid device

An acceleration detector, the spring is a substrate plate, e.g., of Al.sub.2 O.sub.3, which is fixed at one end in a housing. The resistors and the evaluating circuit are arranged on the spiral spring and can be applied to the substrate plate in a single work step using thick-film technology.

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Reutlingen, Germany

Dieter Seipler