Northern Telecom Limited

Dieter O Marx

Larry K Wong

Geoffrey N Gale

In an electronic module two or more circuit packs are included in a housing and are connected to a printed circuit board extending laterally of the circuit packs and also within the housing. The housing is an electromagnetic radiation shield. The printed circuit board has a single connector for connection to a back plane. This structure avoids misalignment and insertion force problems found when two or more packs are housed within a housing and are individually connected to a back plane.

Electronic modules, circuit packs and sealing arrangements

A multiple layer printed circuit board and a method of manufacturing multiple layer printed circuit boards which incorporate integral edge shielding in combination with top and bottom shielding to effectively provide a sandwich arrangement within a Faraday Cage. Electromagnetic emissions radiating from an outside surface of either the top or bottom shielding layer are substantially reduced. In one structure, a multiple layer printed circuit board having a sandwich arrangement which includes at least one inner conductive layer for providing a ground plane disposed between the outer shielding layers, the inner conductive layer being electrically connected directly to the edge shielding means and hence to the outer conductive layers. The larger and more continuous surface area provided by the direct connection to the edge shielding effectively provides an electrical connection having a low inductance and hence in operation results in all ground planes having a more constant non-varying potential.

Method of manufacturing a multiple layer printed circuit board

A multiple layer printed circuit board and a method of manufacturing multiple layer printed circuit boards which incorporate integral edge shielding in combination with top and bottom shielding to effectively provide a sandwich arrangement within a Faraday Cage. Electromagnetic emissions radiating from an outside surface of either the top or bottom shielding layer are substantially reduced. In one structure, a multiple layer printed circuit board having a sandwich arrangement which includes at least one inner conductive layer for providing a ground plane disposed between the outer shielding layers, the inner conductive layer being electrically connected directly to the edge shield and hence to the outer conductive layers. The larger and more continuous surface area provided by the direct connection to the edge shielding effectively provides an electrical connection having a low inductance and hence in operation results in all ground planes having a more constant non-varying potential.

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Kanata, Canada

Dieter O Marx