Temic Telefunken Microelectronic Gmbh

Daimler-benz Aerospace Ag

Dieter Nagele

Manfred Weinacht

Gerald Brinks

Thomas Ohgke

Viktor Tiederle

Klaus Farber

A piezoelectric acceleration transducer characterized by a flexible element formed of a piezoelectric material with two external electrodes, a support member having two plate-type supporting components between which the flexible member is arranged, and a carrier plate to which the support member is mechanically and electrically connected such that the principal axis of sensitivity of the flexible element lies in the same plane as the carrier plate. The supporting components may be formed of a nonconducting material with a electrically conductive coating on the side facing the flexible element and at a point of contact with the carrier base. Alternatively, the supporting components may be made from an electrically conductive material.

Piezoelectric acceleration transducer

System for packaging integrated circuits, especially sensors, in a housing, which also comprises multicontact bondings, especially hybrid ICs for three-dimensional arrangement of modules, wherein sensors (4, 5) are arranged at an angle in relation to one another on the base plate or the substrate (1). The sensors are contained in the single housing together with contact pins (pins) (2), and are connected in one plane by automatic bonding.

Bonding and encapsulated three dimensional hybrid integrated circuit

Growing community of inventors

Filderstadt, Germany

Dieter Nagele