Atmel Germany Gmbh

Telefunken Electronic Gmbh

Atmel Automotive Gmbh

Dieter Mutz

Jorg Angerstein

Elmar Wagner

Hans-Peter Waible

Steffen Ziegler

Klaus Burger

A method and a casting mold for producing an optical semiconductor module is provided, wherein a semiconductor body having at least one optically active element on its top is introduced into a leadframe. Then conductive connections are established between the semiconductor body and the leadframe, and then the leadframe and semiconductor body are encapsulated in a casting mold. Wherein provided in the part of the casting mold that faces the top of the semiconductor body are masking bodies, which extend from the top inner wall of the casting mold towards the optically active elements and cover the elements with their respective end face in a way that seals out casting material.

Casting mold for producing an optical semiconductor module

A fluid sensor is provided for determining a fluid characteristic, having an electronic sensor element that has an active surface for determining the fluid characteristic, having a mounting plate associated with the sensor element, and having a filter device associated with the sensor element for filtering the fluid, in which the active surface of the sensor element is oriented toward the mounting plate and in which the mounting plate is provided with an opening opposite from the active surface of the sensor element. According to an embodiment the invention, an end region of the filter device is accommodated in a sealed fashion in the opening of the mounting plate. Furthermore, the fluid sensor can be used for tire pressure measurement.

Fluid sensor

In a method of opening of a housing of a plastic-housed electronic module by a laser, the electronic module is protected from the effects of the laser beam and the laser beam is stopped at a suitable time by providing an end point signal detection due to the laser beam impinging on a protective layer. Thereby, after opening the housing, electrical measurements can be carried out on the electronic module.

Method for opening the plastic housing of an electronic module

The invention relates to an optical system comprising a semiconductor laser and an optical instrument collimating the laser light. In accordance with the invention, the semiconductor laser and the optical instrument are accommodated in separate holders which are adjusted relative to one another in such a way that a criterion relating to the laser light is optimally fulfilled. After completion of the adjustment, the two holders, both forming the external housing of the entire system, are joined to one another.

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Heilbronn, Germany

Dieter Mutz