Siemens Aktiengesellschaft

Infineon Technologies Ag

Dieter Maier-Schneider

Stefan Kolb

Klaus-G&uuml;nter Oppermann

Hans-J&ouml;rg Timme

Robert Aigner

Wolfgang Werner

Christofer Hierold

Thomas Scheiter

Peter-Christian Eccardt

Hergen Kapels

Kurt Niederer

A micromechanical, capacitative ultrasound transducer having a planar membrane is adapted such for manufacturing an air gap between membrane and cooperating electrode that the membrane collapses. The width of the air gap is thereby defined by nubs located on the membrane that lie against the cooperating electrode.

Micromechanical, capacitative ultrasound transducer and method for the manufacture thereof

A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.

Micromechanical component protected from environmental influences

A micromechanical structure, such as a sensor, includes a substrate, a diaphragm, a cavity, a sacrificial layer and a terminating structure. The terminating structure is cut away in the region of the diaphragm in such a way that a media opening is located above the diaphragm. The diameter of the cavity is smaller over the entire circumference of the cavity than the diameter of the opening. A method for manufacturing the micromechanical structure is also provided.

Micromechanical structure, sensor and method for manufacturing the same

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Markt Schwaben, Germany

Dieter Maier-Schneider