Leybold Aktiengesellschaft

Leybold-heraeus Gmbh

Demetron Gesellschaft Fuer Elektronik-werkstoffe M.b.h.

Dieter Hoffman

Wolf-Dieter Munz

G A Siewert

Horst Dietrich

A process using a multiple-substance alloy having a gold content most preferably in the range of 94 to 98 percent by weight as a target in a cathode sputtering apparatus is disclosed. The alloy further contains non-gold elements of aluminum, copper and preferably an element of the group of Co, Ni, G, Ti, In, Cd, Sn, Fe and Pd.

Process and apparatus for sputter coating a gold alloy onto a substrate

A multiple-substance alloy used as a target in a cathode sputtering apparatus, and having a gold content most preferably in the range of 94-98 percent by weight, is disclosed. The alloy further contains non-gold alloys of aluminum, copper and preferably an element of the group of Co, Ni, Ga, Ti, In, Cd, Sn, Fe and Pd.

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Bruchkobel, Germany

Dieter Hoffman