Siemens Aktiengesellschaft

Shell Oil Comapny

Siemens Aktiengesell Schaft

Saint-gobain Glass France

Dieter Dlugosch

Karl-Heinz Ideler

Winfried Arz

Heiner Bayer

Josef Kirschbauer

Karl-Heinz Gunzelmann

Gunter Didschies

Gudrun Kühne

Roland Prass

Hermann Calwer

A component involving a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure, wherein the barrier layer has the reaction product of an epoxy resin and a polymeric polyol.

Barrier layer made of a curable resin containing polymeric polyol

The smart card has a semiconductor chip combined with a leadframe. The smart card is rendered operationally and functionally reliable with regard to bending and tensile stresses, in that the connecting tabs which form the electrical contacts of the leadframe are extended to the outside and embedded in the plastic card body. Beads are incorporated for the additional relief of mechanical stresses.

Smart card with card body and semiconductor chip on a leadframe

A thermally conductive, electrically insulating connection, which is not sensitive to air moisture comprises a ceramic layer formed by thermal spraying on a surface of the workpiece, which layer is either impregnated or sealed with electrically insulating material and is joined to another workpiece which may be a ceramic layer which has been either impregnated or sealed and attached to another member. The connection is particularly useful in power assemblies with at least one power component for conducting away lost heat from the component with a sufficient electrical insulation of the component from the cooling body or heat sink.

Thermally conductive, electrically insulating connection

A glued connection suitable for attaching high power electronic components to a mounting location, such as on a cooling element, has an electrically insulating base layer of unfilled adhesive applied onto at least one surface of the parts to be glued. An adhesive filled with an electrically insulating powder that has good thermal conductivity is applied onto at least one part surface. Grains of the powder puncture the base layer, and the thickness of the glued connection thus essentially corresponds to the size of the grains.

Thermally conductive, electrically insulating glued connection, method

Growing community of inventors

Heilsbronn, Germany

Dieter Dlugosch