Radiant Technology Corporation

Other

Radient Technology Corp.

Dienhung D Phan

Andrei Szilagyi

Carson T Richert

Selina De Rose-Juarez

Luis Alejandro Rey Garcia

An apparatus for heating and cooling an article is provided. The apparatus comprises an enclosure having top, bottom, and side walls and an entrance and an exit. A first belt system comprising one or more belts extends from a loading position through a portion of the enclosure. The first belt system has a loading end and an unloading end. A second belt system comprising one or more belts extends from the unloading end of the first belt system to an unloading position. The second belt system has a loading end and an unloading end. The enclosure includes one or more heating sources positioned adjacent the first belt system for heating the first belt system.

Apparatus and method for heating and cooling an article

A furnace for reflowing solder on a wafer having a heating chamber with an entrance, an exit, and top, bottom, side, and end walls formed of sheets of porous insulation. The furnace has a first belt, with first and second ends, extending from a loading position into the heating chamber. The furnace has a second belt, with first and second ends; the first end of the second belt is coupled to the second end of the first belt, the second belt extending through the heating chamber. The furnace has a third belt with first and second ends; the first end of the third belt is coupled to the second end of the second belt, the third belt extending through the exit of the heating chamber to an unloading position. The heating chamber also has infrared lamps positioned below the second belt, the infrared lamps heat the second belt, such that the second belt heats the wafer situated on the second belt.

Continuous-conduction wafer bump reflow system

A furnace for reflowing solder on a wafer having a heating chamber with an entrance, an exit, and top, bottom, side, and end walls formed of sheets of porous insulation. The furnace has a first belt extending from a loading position into and through. the heating chamber. The furnace has a second belt coupled to the first belt, the second belt extending through the exit of the heating chamber to an unloading position. The heating chamber also has infrared lamps positioned below the first belt, the infrared lamps heat the first belt, such that the first belt heats the wafer situated on the first belt.

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Westminster, CA, United States of America

Dienhung D Phan