Applied Materials, Inc.

Applied Materials Italia S.r.l.

Diego Tonini

Steven Verhaverbeke

Han-Wen Chen

Kyuil Cho

Giback Park

Vincent Dicaprio

Giorgio Cellere

Guan Huei See

Valentina Furin

Giordano Rocco

Marco Maiolini

John Telle

Andrea Sartoretto

Marco Gajotto

The present disclosure relates to thin-form-factor reconstituted substrates and methods for forming the same. The reconstituted substrates described herein may be utilized to fabricate homogeneous or heterogeneous high-density 3D integrated devices. In one embodiment, a silicon substrate is structured by direct laser patterning to include one or more cavities and one or more vias. One or more semiconductor dies of the same or different types may be placed within the cavities and thereafter embedded in the substrate upon formation of an insulating layer thereon. One or more conductive interconnections are formed in the vias and may have contact points redistributed to desired surfaces of the reconstituted substrate. The reconstituted substrate may thereafter be integrated into a stacked 3D device.

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is structured by micro-blasting or laser ablation to form structures for formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor package with embedded dies therein.

Package structure and fabrication methods

Growing community of inventors

Treviso, Italy

Diego Tonini