Inside Technologies

Inside Contactless

Other

Fasver Sa

Trantoul, Francois

Didier Serra

Jacek A Kowalski

Bruno Charrat

Francois Trantoul

Jean-Yves Leroy

Pierre Pic

Eric Jouve

Fr&eacute;d&eacute;ric Bertholio

A contactless integrated circuit is provided that includes a RFID communication interface, a UHF communication interface, a data processing unit, an interface multiplexer, a communication mode detection circuit, a first modulation and demodulation circuit, a second modulation and demodulation circuit, and a multiplexer demultiplexer circuit. The interface multiplexer couples the data processing unit to the RFID or UHF communication interfaces. The multiplexer demultiplexer circuits are driven by mode signals delivered by the communication mode detection circuit, to link the data processing unit to one of the two modulation and demodulation circuits.

RFID-UHF integrated circuit

A method and a device for protecting text for reading (), arranged on at least one written face () of an object (). The object () is connected to at least one matching antenna (), produced by printing on a support () and having at least one electromagnetic coupling zone () with an individual antenna of smaller dimensions. At least one security film (), not provided with a matching antenna () but with at least one individual integrated antenna microcircuit called a microtransponder (), is applied to cover the text for reading () for which authentication information may be delivered using the microtransponder ().

Method and device for protecting text for reading

An electronic tag ( ) is provided comprising a contactless integrated circuit ( ) and a main coil antenna (Ls) comprising at least two distinct non-coplanar and/or non-coaxial windings (Ls -Ls ) arranged in series. Applications to the reading of a tag from any face of a three-dimensional object.

Contactless electronic tag for three-dimensional object

The present invention relates to a device ( ) comprising a combination of at least two contactless integrated circuits ( ), each integrated circuit being connected to an individual antenna coil ( ) to send and/or receive data by inductive coupling. According to the present invention, the device comprises a collective antenna coil ( ) that is larger in size than the individual antenna coils of the integrated circuits, and means ( ) for arranging the individual antenna coil of an integrated circuit proximate to the collective antenna coil, at least when data are to be read and/or written in the integrated circuit, so that the individual antenna coil of the integrated circuit is inductively coupled to the collective antenna coil. Application to smart cards, electronic badges or electronic labels.

Portable electronic device comprising several contact-free integrated circuits

An electronic micromodule includes a support wafer, and an integrated circuit chip on the support wafer. The integrated circuit chip includes electrical connector areas, and at least one insulation layer is on the support wafer and the integrated circuit chip. The insulation layer includes openings to the electrical connector areas. At least one flat winding defining a coil is on the insulation layer and is connected to the electrical connector areas. A conducting material is in in each of the openings through the insulation layer for connecting the coil to the electrical zconnector areas.

Growing community of inventors

Septeme les Vallons, France

Didier Serra