Motorola Corporation

Abbvie Inc.

Virginia Tech Intellectual Properties, Inc.

Abb Vie Deutschland Gmbh & Co. Kg

Bds Pharma Gmbh

Bit Pharma Gmbh

Didier Lefebvre

Jorg Breitenbach

Shiuh-Hui Steven Chen

Bernd Liepold

Thomas Kessler

Soumojeet Ghosh

Jörg Breitenbach

Kevin Novak

Joerg Breitenbach

Joe Pin Wang

Peter Hölig

Jang-Horng Yu

Cheryl B Field

Steffen Bossmann

David A Dillard

Benedikt Steitz

Bryan Wiesner

Peter HÖLIG

The present invention relates to a process for producing monolithic tablets. The method employs a melt-processed composition containing at least on active agent and at least one thermoplastic binder. The invention further relates to a method for cutting and deflashing a belt of pre-shaped bodies of a melt-processed composition, wherein the pre-shaped bodies are interconnected by flash.

Method for producing monolithic tablets

A delivery system for sustained release of a calcium-channel blocking agent is adapted for introduction in the cerebrospinal fluid of a subject. The delivery system comprises a solid dispersion product of a calcium-channel blocking agent in a mixture of a (i) first poly(lactide-co-glycolide) having a molecular weight distribution centered around a first number average molecular weight Mnand a (ii) second poly(lactide-co-glycolide) having a molecular weight distribution centered around a second number average molecular weight Mn, wherein Mnis in the range of from 2000 to 3000 g/mol and the ratio of Mn/Mnis from 1.8 to 3.5. The delivery system is deposited in the vicinity of or adjacent to a blood vessel showing vasospasm or suspected of developing vasospasm.

Delivery system for sustained release of a calcium-channel blocking agent

A method of separating a thin die ( ) from a support body ( ) of a semiconductor wafer ( ). The thin die ( ) being initially attached to the support body ( ) by an attachment mechanism ( ). The attachment mechanism may be a plurality of tethers ( ) that extend between the thin die ( ) and the support body ( ). The method may include the steps of: positioning the wafer ( ) on a rigid backing ( ) having a hole ( ), the hole ( ) positioned beneath the thin die ( ); positioning a tip ( ) of a handler ( ) above the thin die ( ), the tip ( ) having a passageway ( ) to a vacuum source; positioning an ejection pin ( ) in a spaced apart relationship beneath the thin die ( ); moving the tip ( ) of the handler ( ) downward toward the thin die ( ) to break the attachment mechanism ( ) and clamp the thin die ( ) between the tip ( ) of the handler ( ) and the ejection pin ( ); and moving the ejection pin ( ) upward in the direction of the tip ( ) of the handler ( ) until the thin die ( ) is extracted from the wafer ( ).

Method of separating and handling a thin semiconductor die on a wafer

A method and apparatus for determining bulk material constants such as Poisson's ratio and the ratio of shear modulus to bulk modulus for elastomeric materials, including, but not limited to elastomers, rubbers, gels and sealants is disclosed. The bulk material properties are determined by measuring the pressure change of the elastomeric material when the elastomeric material is subjected to an applied pressure. The changes in the bulk material property due to temperature or a the addition of a diluent may also be determined. The apparatus includes a container that holds the elastomeric material. A pressure sensor is located in the container and is positioned to measure the pressure of the elastomeric material. The signal from the pressure sensor along with the applied pressure is used to determine a bulk material property such as Poisson's ratio or the ratio of shear modulus to bulk modulus for the elastomeric material.

Method and apparatus for determining bulk material properties of elastomeric materials

Growing community of inventors

Mundelein, IL, United States of America

Didier Lefebvre