Gemplus

Gemalto Sa

Tagsys

Smart Packaging Solutions (Sps)

Tagsys Sas

Gemplus S.a., Inc.

Smart Packaging Solutions

Fenotag

Invengo Technologies Sarl

Smartflex Innovation Pte. Ltd.

Didier Elbaz

Philippe Patrice

Jean-Christophe Fidalgo

Olivier Brunet

Stephane Ayala

Bernard Calvas

Pierre Merlin

Francois Combes

Philippe Martin

Michel Chomette

François Moutel

Jean Christophe Fidalgo

Franck D'Annunzio

Thomas Battmann

François Combes

D'ANNUNZIO Franck

Alain Salvagione

Simon Ormerod

David Derrien

The invention relates to a method for manufacturing a radio-frequency identification tag comprising a textile material backing intended to receive a radio-frequency identification module coupled with an electrical antenna. The method comprises the following steps:

Method for producing a radio-frequency identification tag

A process is disclosed for attaching an RFID tag such as an AK module or QFP package to a flexible surface such as textile or fabric. The process comprises providing a heat fusible label including at least a first layer having a first adhesive layer, a substrate layer including a secondary antenna structure, a heat activated second adhesive layer and a pressure sensitive adhesive (PSA) layer for holding the RFID tag. The process further includes positioning the RFID tag on the PSA layer, pressing the tag against the PSA layer such that the PSA layer holds the tag against the heat fusible label at least temporarily, positioning the heat fusible label with the RFID tag on the flexible surface and applying heat and pressure to the heat fusible label to melt the heat activated layer and to fuse the label to the flexible surface.

RFID tag assemblies and process

The invention relates to an insert for a multilayer chip card, including an intermediate sheet and, on either side of the intermediate sheet, at least one outer sheet having a face in close contact with the corresponding face of the intermediate sheet, the intermediate sheet including at least one recess prior to the lamination of the insert. The insert having at least one of the outer sheets is made from a fluent material, such that, when the intermediate sheet is being laminated with the outer sheets, part of the material of the outer sheets moves into the recess in the intermediate sheet, thereby forming a visual and/or tactile defect on the surface of the insert, indicating whether of not the insert and/or the chip card is authentic.

Secure insert intended, notably, for a chip card

A dongle is formed by a module having an integrated circuit chip which is connected to contact pads which are flush with the surface of the module. The dongle is intended to be connected to a port of a telecommunications device, having electric connecting pins. The contact pads correspond to the electric connecting pins in such a way that the pads can be directly connected to the pins.

Dongle which is intended to be connected to a port of a telecommunications device

An adapter electrically connects an integrated circuit mini-card in a main electronic integrated circuit memory card connector having greater space requirement than the mini-card. The mini-card has surface contact strips and the adapter includes a main body capable of being connected to the main connector and a housing for receiving the mini-card at the surface of the main body. The housing includes inside bond pads for connection to the electric contacts of the mini-card. A mobile cover is capable of taking up a position wherein it closes at least partly the housing while maintaining the mini-card in electrically connecting position in the housing and stiffening the structure of the adapter.

Adapter for electrically connecting a miniature integrated circuit card in a memory card connector

The present invention relates to a method of fabricating at least one electronic module or label which is adapted to be rendered adhesive. The method includes the following steps: an insulative film is supplied including at least one contact and/or antenna type interface, and an adhesive tape is supplied including an activatable adhesive and a removable protective film. The tape includes at least one perforation corresponding to the area of the resin on the module or label. The adhesive tape is applied to the support film so that the perforation coincides with the area of the resin and the adhesive is activated so that it fixes the tape to the film. The coating resin is dispensed over the intended area at least within the perforation and in contact with the perforation. The invention also provides a method in which the activatable adhesive is deposited with no protection film.

Method of fabricating an electronic module or label, module or label obtained and medium including a module or label of this kind

The invention concerns a method for protecting integrated circuit chips of a silicon wafer. The silicon wafer is cut so as to disengage the chips from the integrated circuit; and a fluid insulating material is applied on the rear surface of the wafer so as to coat the flanks of each chip of the integrated circuit with a thin insulating layer. The insulating material may be applied by spraying, screen printing, dip coating, casting or any other means. The invention further concerns integrated circuit chips where the flanks are protected by an insulating material to prevent electrical malfunction caused by contact of a conductive material on the flanks of the chips.

Method for protecting an integrated circuit chip

The invention relates to a chip card ( ) including an electronic module, which module is fitted with an interface for electrical and/or electromagnetic communications formed by electrical contacts ( ) and/or an antenna ( ). It is characterised in that it includes at least one guarantee label ( ) which is bonded to one of its surfaces and which can be unbonded by breaking the adhesion, said label being suitable for preventing said interface ( ) from communicating with the outside world.

Smart card provided with guarantee label

Connecting terminal for chip cards

Growing community of inventors

Marseilles, France

Didier Elbaz