Lenovo (singapore) Pte. Ltd.

International Business Machines Corporation

Diane S Busch

Troy Williams Glover

Whitcomb Randloph Scott, Iii

Paul Andrew Wormsbecher

Michael Sean June

William Mark Megarity

Chunjian Ni

Alvin G Davis

Pradeep Ramineni

April E Ruggles

A server chassis, including: a first compartment configured to receive one or more central electronics complexes ('CECs'); and a second compartment configured to receive one or more fans for cooling the one or more CECs, wherein the second compartment is coupled to the first compartment such that: the second compartment is inserted within the first compartment when the second compartment is in an operational position; and the second compartment is outside of the first compartment and rotated relative to the first compartment when the second compartment is in a service position.

Central electronics complex ('CEC') and fan structure

A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

Heat sink with orientable fins

A computer program product including computer usable program code embodied on a computer usable medium for controlling a temperature within a computer system using a fan. The computer program product includes computer usable program code for monitoring the temperature within the computer system; dynamically selecting a fan speed step in response to the temperature, wherein the fan speed step is selected from a fan speed table defining a finite number of fan speed steps each having an associated fan speed; operating a fan at the dynamically selected fan speed step; measuring a fan output variation is measured over a prescribed time interval; and automatically modifying the fan speed table to change the fan speeds associated with each fan speed step, wherein the fan speeds are changed as a function of the measured fan output variation while continuing to drive the fan.

Dynamically modified fan speed table for cooling a computer

A computer-implemented fan control method includes measuring a temperature within a computer system and dynamically selecting a fan speed step in response to the temperature received, wherein the fan speed step is selected from a fan speed table defining a finite number of fan speed steps each having an associated fan speed. A fan is operated at the dynamically selected fan speed step, wherein the fan is positioned to drive air through the computer system where the temperature is being measured. The fan output variation is measured over a prescribed time interval and the fan speed table is automatically modified to change the fan speeds associated with each fan speed step, wherein the fan speeds are changed as a function of the measured fan output variation while continuing to drive the fan.

One embodiment provides a vapor chamber having an outwardly protruding boss. A frame surrounds a perimeter of the vapor chamber. A plurality of heat sink fins extend from the frame. A cross-member spans the frame across the vapor chamber wall and defines an opening through which the boss protrudes at least slightly beyond the cross-member. The heat sink may be secured to a socket on a circuit board, with the boss engaging a processor positioned in the socket. In response to securing the heat sink, the boss compresses flush with the cross-member and the cross-member engages the processor to seat the processor in the socket. The opening in the cross-member reinforces the boss against outward deformation.

Growing community of inventors

Durham, NC, United States of America

Diane S Busch