Texas Instruments Corporation

Diane Louise Arbuthnot

Gonzalo Amador

Jose L Melendez

Richard A Carr

Christo Pavel Bojkov

Dwight Urban Bartholomew

Robert F Kunesh

A method for preparing a bonding pad on an integrated circuit wafer by the steps of depositing a conductive seed layer () on the bonding pad; depositing a metal layer (, and) over a portion of the conductive seed layer; and immersing the wafer in an etchant solution () to remove the portion of the seed layer not covered by the metal layer. The etchant solution contains a chelating agent that bonds ions from the seed layer. When the seed layer is copper or a refractory metal, and the metal layer is gold or palladium, the preferred chelating agent is selected from, but is not limited to, but is not limited to, the families of ethylenediaminetetraacetic acids (EDTA), 8-hydroxy-quinolines, including 8-hydroxy-quinoline-5-sulfonic acid, porphyrins, and phthalocyanines.

Method for chemical etch control of noble metals in the presence of less noble metals

An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the direction of adjacent connection mushrooms and an elongated axis orthogonal to the short axis. The increased larger volume solder when reflowed produces the larger diameter/taller bolder ball bump.

Variable cross-section plated mushroom with stud for bumping

A network for detecting a substance includes at least two detectors that are capable of transmitting a signal, and a remote station capable of receiving the signal. The detectors are adapted to detect a substance and transmit data that indicates the presence of that substance to the remote receiving station.

Networked miniature chemical optical sensors

An integrated biochemical sensor (200) for detecting the presence of one or more specific samples (240) having a device platform (355) with a light absorbing upper surface and input/output pins (375) is disclosed. An encapsulating housing (357) provides an optical transmissive enclosure which covers the platform (355) and has a layer of fluorescence chemistry on its outer surface (360). The fluorophore is chosen for its molecular properties in the presence of the sample analyte (240). The detector (370), light sources (365, 367, 407, 409) are all coupled to the platform (355) and encapsulated within the housing (357). A filter (375) element is used to block out unwanted light and increase the detector's (370) ability to resolve wanted emission light.

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Plano, TX, United States of America

Diane Louise Arbuthnot