Intel Corporation

Dheeraj Subareddy

Md Altaf Hossain

Ankireddy Nalamalpu

Sandeep B Sane

Mahesh K Kumashikar

Anshuman Thakur

A processor package module comprises a substrate, one or more compute die mounted to the substrate, and one or more photonic die mounted to the substrate. The photonic die have N optical I/O links to transmit and receive optical I/O signals using a plurality of virtual optical channels, the N optical I/O links corresponding to different types of I/O interfaces excluding power and ground I/O. The substrate is mounted into a socket that support the power and ground I/O and electrical connections between the one or more compute die and the one or more photonic die.

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Portland, OR, United States of America

Dheeraj Subareddy