Corning Incorporated

Dhananjay Joshi

Yousef Kayed Qaroush

Andrew Peter Kittleson

Charlene Marie Smith

Qiang Fu

Ljerka Ukrainczyk

Guangli Hu

Bin Yang

Carol Ann Click

Rohit Rai

John Richard Ridge

Matthew Daniel Trosa

Mathieu Gerard Jacques Hubert

Galan Gregory Moore

Eunyoung Park

Shinu Baby

Erika Lynn Stapleton

James Howard Edmonston

Naigeng Chen

Timothy Michael Gross

Yuhui Jin

Edward John Fewkes

James Ernest Webb

Zheming Zheng

Jill Marie Hall

John Robert Saltzer, Jr

Shelby Kerin Wilson

Katherine Weber Kroemer

Jason Thomas Harris

Scott Christopher Pollard

Matthew Wade Fenton

Bin Zhang

Michael William Price

Ying Zhang

Chunhe Zhang

Chukwudi Azubuike Okoro

Kuan-ting Kuo

Tingge Xu

Mathieu Gerard Hubert

Jr Saltzer

Foldable apparatus comprise a foldable substrate foldable about an axis and a substrate thickness defined between a first major surface and a second major surface. The foldable substrate comprises a central portion positioned between a first portion and a second portion. The first portion comprising a substrate thickness. The central portion comprises a central thickness that is less than the substrate thickness. In some embodiments, a width of central portion is about 45 millimeters or less. Methods of making a foldable apparatus comprise forming a recess in a first major surface of the foldable substrate. In some embodiments, methods comprise chemically strengthening the foldable substrate.

Foldable apparatus, foldable substrate, and methods of making

Foldable apparatus can comprise a foldable substrate comprising a substrate thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a central thickness less than the substrate thickness. A first maximum tensile stress of a first tensile stress region in the first portion and a second maximum tensile stress of the second tensile stress region in the second portion can be less than a third maximum tensile stress of a central tensile stress region in the central portion. Ribbons can comprise a ribbon thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a first central compressive stress region and a second central compressive stress region. In some embodiments, methods of processing a ribbon can comprise masking the first portion, masking the second portion, and chemically strengthening the central portion.

Foldable apparatus, ribbons, and methods of making

Articles including a substrate, a cover glass layer disposed over a top surface of the substrate, and an adhesive layer having a dynamic elastic modulus disposed between a bottom surface of the cover glass layer and the top surface of the substrate. The cover glass layer may have a thickness in the range of 1 micron to 200 microns. The dynamic elastic modulus of the adhesive layer may include a first elastic modulus in the range of 10 kPa to 1000 kPa measured at a stress frequency in the range of 0 Hertz to 5 Hertz and a temperature of 23 degrees C., and a second elastic modulus of 500 MPa or more measured at a stress frequency in the range of 10 Hertz to 1000 Hertz and a temperature of 23 degrees C. The adhesive layer may be optically transparent. The articles may be bendable electronic display devices or bendable electronic display device modules.

Bendable articles including adhesive layer with a dynamic elastic modulus

A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.

Beveled overburden for vias and method of making the same

A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (μm)<(3.65×10/μm×diagonal) where diagonal is a diagonal measurement of the glass ceramic article in μm, a stress of less than 30 nm of retardation per mm of glass ceramic article thickness, a haze (%)<0.0994t+0.12 where t is the thickness of the glass ceramic article in mm, and an optical transmission (%)>0.91×10of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.

Glass ceramic articles having improved properties and methods for making the same

A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (&#x3bc;m)&#x3c;(3.65&#xd7;10/&#x3bc;m&#xd7;diagonal) where diagonal is a diagonal measurement of the glass ceramic article in &#x3bc;m, a stress of less than 30 nm of retardation per mm of glass ceramic article thickness, a haze (%)&#x3c;0.0994t+0.12 where t is the thickness of the glass ceramic article in mm, and an optical transmission (%)&#x3e;0.91&#xd7;10of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.

A foldable electronic device module includes: a glass-containing cover element having a thickness from about (25) &#x3bc;m to about (200) &#x3bc;m, an elastic modulus from about (20) to (140) GPa, and first and second primary surfaces; a stack comprising: (a) an interlayer having an elastic modulus from about (0.01) to (10) GPa and a thickness from about 50 to (200) &#x3bc;m, and (b) a flexible substrate having a thickness from about (100) to (200) &#x3bc;m; and a first adhesive joining the stack to the cover element, and comprising an elastic modulus from about (0.001) to (10) GPa and a thickness from about (5) to (25) &#x3bc;m. Further, the module comprises an impact resistance characterized by tensile stresses of less than about (4100) MPa and less than about (8300) MPa at the first and second primary surfaces of the cover element, respectively, upon an impact in a Pen Drop Test.

Foldable electronic device modules with impact and bend resistance

A foldable electronic device module that includes a glass cover element having a thickness from about 25 &#x3bc;m to about 200 &#x3bc;m, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 &#x3bc;m to about 600 &#x3bc;m; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.

Bendable electronic device modules, articles and bonding methods of making the same

A foldable electronic device module includes a glass cover element having a thickness from about 25 &#x3bc;m to about 200 &#x3bc;m, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 &#x3bc;m and about 600 &#x3bc;m; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.

Bendable electronic device modules, articles and methods of making the same

A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (&#x3bc;m)&#x3c;(3.65&#xd7;10/&#x3bc;m&#xd7;diagonal) where diagonal is a diagonal measurement of the glass ceramic article in &#x3bc;m, a stress of less than 30 nm of retardation per mm of glass ceramic article thickness, a haze (%)&#x3c;0.0994t +0.12 where t is the thickness of the glass ceramic article in mm, and an optical transmission (%)&#x3e;0.91&#xd7;10of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.

Growing community of inventors

Painted Post, NY, United States of America

Dhananjay Joshi