Olin Corporation

Lsi Logic Corporation

Vlsi Technology, Inc.

Koninklijke Philips Corporation N.v.

Dexin Liang

German J Ramirez

Paul R Hoffman

Michael A Holmes

Deepak Mahulikar

Arvind Parthasarathi

Andrew J Brock

Efraim Sagiv

Satish K Jalota

Lily Zhao

Jeffrey M Schlater

Mark R Schneider

George A Brathwaite

Ray Killorn

Karla Y Carichner

Linda E Strauman

Sonny S Pareno

The present invention includes an integrated circuit package, a ball-grid array integrated circuit package, a method of packaging an integrated circuit, and a method of forming an integrated circuit package. According to one aspect, the present invention provides an integrated circuit package including a substrate including a first surface, a second surface and a plurality of conductors, the first surface includes a plurality of conductive pads adapted to couple with a plurality of corresponding bond pads of a semiconductor die, and the conductors being configured to couple the conductive pads with the second surface; and a plurality of conductive bumps coupled with the second surface of the substrate and electrically coupled with respective conductors, the conductive bumps being formed in an array including a plurality of power bumps and signal bumps, and the signal bumps being individually positioned immediately adjacent at least one power bump. One method of packaging an integrated circuit includes providing a semiconductor die including a plurality of bond pads; providing a package substrate including a plurality of conductive bumps including plural power bumps and plural signal bumps; arranging individual signal bumps to be immediately adjacent at least one power bump; and electrically coupling the bond pads of the semiconductor die with respective conductive bumps.

Integrated circuit package, ball-grid array integrated circuit package

A flat, thin decoupling capacitor is disposed inside an integrated circuit device in a coplanar relationship with a semiconductor chip and a bonding element. When connected to the power and ground plane of a device substrate or in a leadframe device, the decoupling capacitor is positioned close to the semiconductor chip to substantially reduce ground bounce and crosstalk from the semiconductor chip. When the decoupling capacitor is positioned to locate the semiconductor chip between itself and the device substrate or leadframe device, the decoupling capacitor shields electromagnetic interference from the semiconductor chip.

Integrated circuit device with integral decoupling capacitor

Methods of packaging an integrated circuit and methods of forming an integrated circuit package

A ball grid array package (BGA) according to the present invention has an interposer between a bond pad on the lower surface of the substrate and the solder ball. The interposer has a conductive portion in contact with the bond pad surrounded by a nonconductive or insulating portion. The conductive portion in contact with the bond pad is sufficiently constrained from widening during a subsequent reflow process by the presence of the nonconductive or insulating portion. The contact with the bond pad is sufficiently small to allow traces to pass near the bond pad substantially directly en route to another bond pad. The nonconductive portion also prevents subsequently-applied encapsulant from coming in contact with and contaminating the bond pad. The elevated surface of the interposer, i.e. the surface of the interposer furthest from the bond pad, supports the solder ball, and is sufficiently wide to support the solder ball without allowing the solder ball to come in contact with the traces. The solder ball and the trace routing on the lower surface of the substrate is in different planes, thereby allowing a simplified trace routing, but retaining and even increasing rigidity of the structure and coplanarity of the solder balls.

Interposer for ball grid array (BGA) package

There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Anodized aluminum substrate having increased breakdown voltage

An integrated circuit is mounted on and interconnected with a circuit board by an array of electrically conductive columns. The assembly is fabricated by initially interconnecting the integrated circuit and the circuit board with an array of reflowable electrically conductive solder balls that correspond to the columns respectively. The circuit board is held with the integrated circuit extending downwardly therefrom. Sufficient heat is applied to cause the solder balls to reflow. The integrated circuit is pulled downwardly away from the circuit board by gravity such that the balls are stretched to form the columns, and the assembly is allowed to cool such that the columns solidify. A fixture may be provided against which the integrated circuit abuts after it has moved away from the circuit board by a predetermined distance such that the columns have a precisely determined height.

Microelectronic integrated circuit mounted on circuit board with solder

There is disclosed an adhesively sealed electronic package in which a compensation apparatus is provided for excess adhesive. As a result, excess adhesive does not extend beyond the package perimeter, squeeze-out, or travel along the inner lead fingers interfering with wire bonding. The compensation is a chamfer on the peripheral edges and/or interior edges of the package base component and cover component.

Chamfered electronic package component

There is provided a module for supporting a plurality of semiconductor devices within an electronic package. The module has a support substrate and an apertured substrate laminated together with a polymer adhesive. A plurality of semiconductor devices are disposed within apertures formed in the apertured substrate and bonded to the support substrate by that same polymer adhesive.

Multi-chip electronic package module utilizing an adhesive sheet

There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive accumulates in the recessed channel, eliminating bridging of the adhesive to the leadframe.

Growing community of inventors

Fremont, CA, United States of America

Dexin Liang