Growing community of inventors

Arlington, WA, United States of America

DeWayne F Wendt

Average Co-Inventor Count = 10.00

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 5

DeWayne F Wendt ↔ Karen Lee Hills (2 patents)DeWayne F Wendt ↔ Douglas Alan Brown (2 patents)DeWayne F Wendt ↔ Richard V Phillips (2 patents)DeWayne F Wendt ↔ Robert Cook (2 patents)DeWayne F Wendt ↔ Jason Turner (2 patents)DeWayne F Wendt ↔ Sergio H Sanchez (2 patents)DeWayne F Wendt ↔ Michael John Cloud (2 patents)DeWayne F Wendt ↔ Jason Christopher Lail (2 patents)DeWayne F Wendt ↔ Hun Sok Basom (2 patents)DeWayne F WendtDeWayne F Wendt (2 patents)Karen Lee HillsKaren Lee Hills (37 patents)Douglas Alan BrownDouglas Alan Brown (28 patents)Richard V PhillipsRichard V Phillips (20 patents)Robert CookRobert Cook (16 patents)Jason TurnerJason Turner (12 patents)Sergio H SanchezSergio H Sanchez (7 patents)Michael John CloudMichael John Cloud (7 patents)Jason Christopher LailJason Christopher Lail (2 patents)Hun Sok BasomHun Sok Basom (2 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. The Boeing Company (2 from 22,252 patents)


2 patents:

1. 11235508 - Modular thermoforming system

2. 10576680 - Modular thermoforming system

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
1/4/2026
Loading…