Phononic, Inc.

Phononic Devices, Inc.

Devon Newman

Jesse W Edwards

Abhishek Yadav

Simbarashe Nyika

Brian Alfred Williams

Robert Joseph Therrien

Kevin Shawne Schneider

Edward Joseph Karwacki, Jr

Robert B Allen

Jason D Reed

Arthur Prejs

Mattias K-o Olsson

Mattias Olsson

Frank Holton

Alex R Guichard

Erik P Miller

Austin J Lewis

Mattias K-O Olsson

Systems and method for providing a micro-channel array are provided. In some embodiments, a micro-channel array includes a plurality of micro-channels having a first end and a second end; where at least one of the first end and the second end allows fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes external manifolding for fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes internal manifolding for fluid connectivity between the plurality of micro-channels. This may solve one of the largest causes of low yields and poor performance consistency in the production process while at the same time simplifying production and reducing production costs.

High reliability, microchannel heat pipe array for improved efficiency, simplified charging/discharging and low-cost manufacture

Systems and methods for thermoelectric refrigerated/frozen product storage and transportation are provided. A cooler includes active thermoelectric cooling to maintain internal temperature within cold chain or customer requirements. The active cooler can be used for storage and transportation of refrigerated and frozen food stuffs, medical or biological products, etc. The active cooler maintains stable and uniform temperature control. A drop in module (e.g., removable/replaceable) can convert any insulated box to active cooling. This can be a commercial transport tote that provides high efficiency. The control logic can be enabled as an API to offer remote monitoring/control to utilize on board, wireless, and networked. A use profile can be customized, and a subscription software package can enable this. The solutions described herein can be used across the whole commercial spectrum and can be ready to integrate into large quantity fleet systems.

Thermoelectric refrigerated/frozen product storage and transportation cooler

A thermoelectric device with multiple headers and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric device includes multiple thermoelectric legs, a cold header thermally attached to the thermoelectric legs, and a hot header thermally attached to the thermoelectric legs opposite the cold header. At least one of the cold header and the hot header includes at least one score line. According to some embodiments disclosed herein, this the thermal stress on the thermoelectric device can be greatly reduced or relieved by splitting the header into multiple pieces or by scoring the header by a depth X. This enables the use of larger thermoelectric devices and/or thermoelectric devices with an increased lifespan.

Multi header for thermoelectric device

A hybrid Vapor Compression (VC) and Thermoelectric (TE) heat transport system is provided that maintains a set point temperature range of a chamber and includes a VC system and a TE system. The VC system includes a compressor, a condenser-evaporator connected to the compressor, a first valve connecting the compressor to an evaporator-condenser, and a second valve connecting the evaporator-condenser to a thermal expansion valve. The TE system includes TE modules, a first heat exchanger thermally connected with a first side of the TE modules which connects the first valve and the second valve, and a second heat exchanger thermally connected with a second side of the TE modules which connects the first valve and the second valve. In this way, the VC system and the TE system can be operated individually, in series, or in parallel to increase the efficiency of the hybrid VC and TE heat transport system.

Hybrid vapor compression/thermoelectric heat transport system

A micro-climate control system includes a thermoelectric system integrated with a fan assembly. The thermoelectric system is operable to actively cool or heat air as the air passes through the fan assembly. The thermoelectric system includes a thermoelectric heat pump, a heat reject subsystem, and a heat accept subsystem. The fan assembly is operable to draw air from a space to be conditioned and output conditioned air passed through one of the heat reject subsystem and the heat accept subsystem to the space to be conditioned and output air passed through the other away from the space to be conditioned. In this way, the micro-climate control system may provide localized comfort, while allowing a larger climate control system to maintain a more efficient temperature set point. In this way, the overall energy consumption may be reduced while providing the same level of effective comfort.

Cooled fan for micro-climate control

Thermoelectric heat pump

A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.

Thermoelectric heat pump with a surround and spacer (SAS) structure

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Morrisville, NC, United States of America

Devon Newman