Wolfspeed, Inc.

Devon Michael Diehl

Joshua Venton Negley

Blake Leonardi Darby

An example method includes providing a wide bandgap semiconductor workpiece. The example method includes exposing the wide bandgap semiconductor workpiece to one or more electrical discharges from an electrical discharge machining (EDM) system to reduce a surface roughness of the wide bandgap semiconductor workpiece. Exposing the wide bandgap semiconductor workpiece to the one or more electrical discharges may include submerging a surface of the wide bandgap semiconductor workpiece in a dielectric fluid; positioning an electrode head relative to the surface such that a gap is defined between an end of the electrode head and the surface; and generating an electrical discharge across the gap to create a plasma zone within the gap such that a material is removed from the surface.

Electrical discharge machining processing for semiconductor workpiece

Systems and methods for laser-based surface processing operations on a wide bandgap semiconductor wafer, such as a silicon carbide semiconductor wafer, are provided. In one example, a method includes removing a wide bandgap semiconductor wafer from a boule using a removal process. The method includes ablating, with one or more lasers, an exposed surface resulting from the removal process to remove material from the exposed surface, wherein ablating, with one or more lasers, the exposed surface reduces a thickness of semiconductor material (e.g., by about 25 microns or greater).

Laser-based surface processing for semiconductor workpiece

An example method includes providing a first semiconductor workpiece including a first portion and a second portion. The example method includes providing emission of one or more lasers through a thickness of the first semiconductor workpiece to remove the first portion of the first semiconductor workpiece from the second portion. In some implementations, the second portion has a shape corresponding to a second semiconductor workpiece of a different diameter relative to the first semiconductor workpiece.

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Durham, NC, United States of America

Devon Michael Diehl