Hewlett-packard Development Company, L.p.

Peridot Print LLC

Devin Alexander Mourey

Michael W Cumbie

Chien-Hua Chen

Silam J Choy

James William Stasiak

Si-lam Choy

Zhiyong Li

Vladek P Kasperchik

Jeffrey Allen Nielsen

Eric Lee Nikkel

Christie Dudenhoefer

Kenneth Ward

Michael G Groh

Anthony Donald Studer

Randy Hoffman

Timothy L Weber

Garrett E Clark

Emre Hiro Discekici

James Elmer Abbott, Jr

Sterling Chaffins

Anita Rogacs

Brad Benson

Karsten N Wilson

Si-Iam J Choy

Milo Overbay

Methods of three-dimensional printing can include iteratively applying a polymer build material as individual layers to a powder bed, where the polymer build material includes from about 80 wt % to 100 wt % polymer build particles, and based on a three-dimensional object model, selectively applying a binder agent including an aqueous liquid vehicle and polymer binder particles onto the individual layers of the polymer build material. The polymer binder particles have or are capable of having a melting temperature lower than a melting temperature of the polymer build particles. The methods can include exposing the powder bed to heat at a temperature less than a melting point of the polymer build particles but greater than a melting temperature of the polymer binder particles. The heat causes the polymer binder particles to melt to adhere the polymer build particles together to form a three-dimensional object.

Three-dimensional printing with binder agent

Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Three-dimensional features formed in molded panel

A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.

Microfluidic device with manifold

In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

Molded printhead

Examples include microfluidic devices. Example microfluidic devices comprise a microfluidic channel, a capillary chamber, and a fluidic actuator. The microfluidic channel is fluidly connected to the capillary chamber. The capillary chamber is to restrict flow of fluid therethrough. The fluidic actuator is positioned proximate the capillary chamber. The fluidic actuator is to actuate to thereby initiate flow of fluid through the capillary chamber.

Microfluidic device with capillary chamber

A method may include etching a number of holes into a carrier wafer layer to form a plurality of filters in the carrier wafer layer, patterning a chamber layer over a first side of the carrier wafer layer to form chambers above each filter formed in the carrier wafer layer, forming a layer over the chamber layer, grinding a second side of the carrier wafer layer to expose the number of holes etched into the carrier wafer layer, and bonding a molded substrate to the carrier wafer layer opposite the chamber layer.

Plurality of filters

A digital dispense apparatus includes at least one fluid dispense device, at least one reservoir fluidically connected to the at least one fluid dispense device, a monolithic carrier structure carrying the at least one fluid dispense device and reservoir, the monolithic carrier forming fluid routing between the reservoir and the fluid dispense device.

Monolithic carrier structure including fluid routing for digital dispensing

A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.

Monolithic carrier structure for digital dispensing

A method of preparing a sample may include depositing an aqueous solution comprising copies of a primer into a layer of hydrophobic liquid on a substrate with a thermal inkjet device. A sample may include: a substrate; a layer of hydrophobic liquid on the substrate, the layer of hydrophobic liquid comprising a plurality of droplets of aqueous solution distributed in the layer, wherein the plurality of droplets contain: primers; a polymerase enzyme; deoxynucleotide triphosphates (dNTPs); and a target sequence for replication; and a cover, the cover contacting and covering the layer of hydrophobic liquid.

Method of preparing test samples

In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.

Print head interposers

A surface enhanced luminescence analyte interrogation stage may include a substrate and an array of pillars projecting from the substrate. Each of the pillars may include a polymeric post formed from a first material and a cap on the polymeric post. The cap has a plasmonic surface and is formed from a second material different than the first. A sacrificial coating covers the cap of each of the pillars.

Surface enhanced luminescence analyte interrogation stage with sacrificial coating

A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.

Printhead assembly

A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.

Complex impedance detection

In one example a liquid level sensing device is described. The device includes a carrier and a liquid level sensing device disposed on the carrier. The liquid level sensing interface has an aspect ratio of at least 1:50. A number of liquid level sensing components are disposed on the liquid level sensing interface. The number of liquid level sensing components detect a liquid level in a liquid container. The liquid level sensing device also includes an electrical interconnect to output data collected from the number of liquid level sensing components.

Growing community of inventors

Corvallis, OR, United States of America

Devin Alexander Mourey