Globalfoundries U.S. Inc.

Freescale Semiconductor,inc.

Infineon Technologies Ag

International Business Machines Corporation

Devesh Dwivedi

Siva Kumar Chinthu

Suresh Pasupula

Sanjeev Kumar Jain

Venkatesh P Gopinath

Gunther Lehmann

Siddharth Gupta

Kevin A Batson

Yannick Martelloni

Lejan Pu

Chunsung Chiang

Chandrabhan Kushwah

Sathisha Nanjundegowda

Amit Kumar Gupta

Yatender Mishra

Sundar Veerendranath Palle

Anoop Delampady

A pre-driver includes first, second, third, and fourth P-channel field effect transistors (PFETs) with voltage ratings equal to a low first voltage (V). Between power rails at Vand at a higher second voltage (V), the first and third PFETs are series-connected and the second and fourth PFETs are also series-connected. The third and fourth PFETs are cross-coupled. The first and second PFETs have gates that receive a pre-driver input signal (Pin) that switches between Vand ground and an inverted pre-driver input signal (Pinb), respectively. At an output node between the first and third PFETs, the pre-driver outputs a driver input signal (Din) that switches between Vand V. A circuit includes this pre-driver (e.g., connected between a voltage level shifter and a driver or connected between a voltage level shifter and a buffer).

Compact high voltage pre-driver and circuits including the pre-driver

A disclosed circuit structure includes a voltage level shifter connected to a variable voltage generator for receiving a low supply voltage and to a programmable voltage generator for receiving a high supply voltage that is higher than the low supply voltage. The high supply voltage is programmable to one of multiple different voltage levels. The variable voltage generator tracks the voltage level of the high supply voltage and outputs the low supply voltage based thereon. The high supply voltage is tracked either directly or using the trim bit signal employed by the programmable voltage generator to program the high supply voltage. The low supply voltage is high when the high supply voltage is high to ensure operation within the safe operating area and is low when the high supply voltage drops below some threshold level to ensure operability and, optionally, improve operating speed.

Voltage level shifter with programmable high supply voltage and high supply voltage-dependent variable low supply voltage

The present disclosure relates to semiconductor structures and, more particularly, to a LDO regulator circuit and methods of manufacture. The structure includes a comparator connected to a first transistor of a low drop-out (LDO) circuit; a second transistor connected to the first transistor; and a feedback loop connected to the first transistor and an output of the LDO circuit.

Low drop-out (LDO) regulator circuit

Disclosed are a sense circuit and memory structure incorporating the sense circuit. The sense circuit is connected to voltage rails at VDD1 and VDD2, respectively, where VDD2˜½*VDD1. During a sensing operation, VDD1 provides power to develop a voltage differential between Vdata and Vref on sense nodes. A voltage comparator samples Vdata and Vref and, based on a detectable voltage differential (minVdiff), outputs a data output value. To increase the speed at which minVdiff is reached, an equalization process is performed at the initiation of the sensing operation and includes using pre-charge transistors to quickly equalize the sense nodes to VDD2. Following equalization, Vdata and Vref only need to be pulled up or down from VDD2. Thus, minVdiff is reached faster and sampling by the voltage comparator can be performed earlier in time, reducing the overall time required for performing the sensing operation and for powering the sense circuit.

Multi-rail sense circuit with pre-charge transistors and memory circuit incorporating the sense circuit

A structure includes a level shifter, first and second variable voltage generators, and a programmable voltage generator. The level shifter includes low and high supply voltage nodes and two parallel branches, including multiple transistors, connected between the nodes. The programmable voltage generator generates and applies a high supply voltage (VH) to the high supply voltage node. VH is programmable to one of multiple possible VH levels. Based on the voltage level of VH, the first variable voltage generator generates and applies a low supply voltage (VL) to the low supply voltage node and the second variable voltage generator generates and applies a gate bias voltage (VGB) to gates of some transistors. By tracking VH and adjusting VL and VGB based on thereon, the voltage level shifter operates within the SOA at high VHs, remains operable at low VHs, and maintains operating speed at mid-level VHs.

Voltage level shifter with multi-step programmable high supply voltage and high supply voltage-dependent variable low supply and gate bias voltages

Embodiments of the disclosure provide memory circuit, a sense amplifier and associated method for reading a resistive state in a memory device. The sense amplifier includes a bit cell configurable to a high or low resistance state; a sensing circuit that detects a voltage drop across the bit cell in response to an applied read current during a read operation and generates a high or low logic output at an output node; and a pulse generation circuit that increases the applied read current with an injected current pulse when a low to high transition of the resistive state of the bit cell is detected.

Single ended sense amplifier with current pulse circuit

Embodiments of the present disclosure provide a level shifter, including: first and second NMOS transistors, wherein the sources of the first and second NMOS transistors are coupled to a first voltage, the gate of the first NMOS transistor is connected to an inverse of an input signal that varies between a second voltage and a third voltage, and wherein the gate of the second NMOS transistor receives a buffer of the input signal. a breakdown protection circuit has third and fourth NMOS transistors, the gates of the third and fourth NMOS transistors being connected to the third voltage, the drain of the first NMOS transistor being connected to the source of the third NMOS transistor, and the drain of the second NMOS transistor being connected to the source of the fourth NMOS transistor. A pull-up circuit is connected to the drains of the third and fourth NMOS transistors.

Level shifter with reduced static power consumption

Various embodiments include memory devices and related methods. An embodiment includes circuitry including: a first inverter having a first inverter storage node, the first inverter cross-coupled to a second inverter having a second inverter storage node, wherein each of the first inverter and the second inverter has a reverse bit line controlled feedback transistor coupled between an pull-down transistor and a pull-up transistor, and wherein each pull-down transistor is further coupled to a ground; a first signal line coupled with the reverse bit line controlled feedback transistor of the second inverter; a second signal line coupled with the reverse bit line controlled feedback transistor of the first inverter; a first access transistor coupled with the first inverter storage node, the first signal line, and a third signal line; and a second access transistor coupled with the second inverter storage node, the second signal line, and the third signal line.

8T based SRAM cell and related method

A method for reading a memory cell () of a semiconductor memory () includes initiating a precharge or predischarge operation on a bit line () prior to arrival of a triggering edge of a clock signal () that initiates a read operation. A word line () is activated responsive to the triggering edge of the clock signal (), and data is read from the memory cell ().

Method of reading memory cell

A memory device for efficient word line, bit line and precharge tracking is provided. The memory device includes a memory array, one or more address decoders, a word line driver, a plurality of sense amplifiers, a reference word line column, a reference bit line column, and a control circuit. The control circuit generates a control signal to perform read and write operations on the memory device. The address decoder selects a bit line and a word line. The selected word line is activated by the word line driver. While the reference word line column is used for vertical tracking of the word line, the reference bit line column is used for vertical tracking of the bit line. The sense amplifiers are activated to read the bit line.

Efficient word lines, bit line and precharge tracking in self-timed memory device

A memory device has a first core memory array, a second core memory array, a third core memory array and a fourth core memory array, and a first common reference section for the first core memory array and the second core memory array, and a second common reference section for the third core memory array and the fourth core memory array. Another memory device with shared signals and a method is also provided.

Memory device with shared reference and method

A method supplies voltage to a bit line of a memory device. The method includes precharging, with a precharging device, the bit line to an output potential, deactivating the precharging device during a read action related to the bit line, reading, during the read action, an information via the bit line, and routing, during the read action, a virtual voltage supply line to a supply potential of the memory device to supply voltage to memory cells of the memory device assigned to the bit line. The precharging device of the bit line is activated/deactivated as a function of the potential of the virtual voltage supply line.

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Bengaluru, India

Devesh Dwivedi