Vitesco Technologies Gmbh

Continental Automotive Gmbh

Siemens Aktiengesellschaft

Detlev Bagung

Thomas Riepl

Christina Quest-Matt

Daniela Wolf

Gregory Drew

Christian Pump

Michael Decker

Bernd Roller

Holger Schlotter

Frank Baur

Christian Lammel

Gunter Ludwig

Sorin Andrei

Jürgen Bock

Guenther Ruppaner

Robert Bushnell

Hubert Horn

Jérome Chastanet

Christina Quest-matt

A power semiconductor component includes at least one power semiconductor device disposed within a housing and a heat sink having an area a exposed on a first surface of the housing. A wiring substrate has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is disposed on the second main surface. The heat dissipation region has an area A on the second main surface, and a<A. The housing with the power semiconductor device is disposed on the second main surface of the wiring substrate in such a way that the heat sink is disposed completely on the heat dissipation region and is connected thereto by way of a solder layer. A method for producing a power semiconductor component is also provided.

Power semiconductor component and method for producing a power semiconductor component

A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.

Semiconductor component arrangement, method for fabrication thereof and heat dissipation device

A power semiconductor component is specified, having a power semiconductor device arranged within a housing, wherein a heat sink is exposed on a first surface of the housing; a wiring substrate which receives the housing with the power semiconductor device and which has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is arranged on the second main surface. The housing is arranged on the wiring substrate in such a way that the heat sink is connected to the heat dissipation region via a solder layer. A number of spacers which are arranged between the heat sink and the heat dissipation region are embedded in the solder layer. Furthermore, a method for producing a power semiconductor component is specified.

A charging device module for installation in an electrically driveable vehicle, including a charging device and an internal cooling circuit for cooling the charging device, wherein the internal cooling circuit has connections for connection to a superordinate cooling circuit of the vehicle, wherein the connections comprise at least one inlet and at least one outlet, and a bypass line connects the at least one inlet to the at least one outlet while bypassing the internal cooling circuit, wherein an actuable valve is associated with the at least one inlet, by which valve the flow of coolant through the internal cooling circuit and the bypass line can be controlled.

Charging device module for installation in an electrically driveable vehicle, vehicle and method for cooling components of an electrically driveable vehicle

A semiconductor assembly includes a semiconductor component having a redistribution substrate with a top side, an underside and a semiconductor chip on the top side. Contact connection pads for connection to contact pads of the chip are on the top side of the substrate. External contact pads on the underside are electrically connected to the contact connection pads by conductor tracks. The external contact pads are at a greater distance from one another in a first region than a second region of the underside. The semiconductor component is on a printed circuit board. Contact pads corresponding to the external contacts are on a top side of the printed circuit board and are at a greater distance from one another in a first region than a second region of the top side. Through holes are formed between the contact pads in the first region of the printed circuit board.

Semiconductor assembly

A housing has electrically conductive top and bottom parts which together form an accommodation chamber. A circuit board is arranged in the accommodation chamber. A bottom side of the circuit board is connected electrically to the top side via conductive bores. The circuit board has circuit components and electromechanical plug components for connecting to components outside the housing. A first electrically conductive separating wall electrically connects the housing top part to the top side of the circuit board. A second electrically conductive separating wall electrically connects the housing bottom part to the bottom side of the circuit board. The first and second separating walls subdivide the accommodation chamber into first and second accommodation-chamber sections that are disposed on opposite sides of the first and second separating walls. The circuit components are accommodated only in the first accommodation-chamber section and the plug components are accommodated only in the second accommodation-chamber section.

Device

An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.

Electrical component and method for the production thereof

An electronic assembly, has at least one circuit board with conductor tracks, at least one current-limiting arrangement in the form of a thermal predetermined breaking point in at least one of the conductor tracks, and a fire-containment device in the region of the current-limiting arrangement.

Electronic unit having an assembly for limiting current

A printed circuit board has first, second, and third printed circuit board sections extending along a longitudinal direction between two transverse edge outer sides of the printed circuit board. The printed circuit board has at each of its two longitudinal ends a respective transverse edge strip, which has regions of the first, second, and third printed circuit board sections and extends continuously transversely with respect to the longitudinal direction along a transverse edge outer side. A depression is formed in the third printed circuit board section on the first printed circuit board side between the two transverse edge strips. The first and/or second printed circuit board sections has a first metallic conductor track section that extends electrically conductively right into one or both of the two transverse edge strips.

Printed circuit board and method for processing a printed circuit board

A method for testing a printed circuit board includes providing a printed circuit board having a first main section, a second main section, a bent connecting section and at least one monitoring conductor track. The connecting section is disposed between the first main section and the second main section. The monitoring conductor track runs from the first main section, in a curved manner through the connecting section, to the second main section. At least one electrical measurement value which is representative of the integrity of the at least one monitoring conductor track is detected. A printed circuit board, a control unit and methods for producing the printed circuit board and for operating the control unit are also provided.

Printed circuit board with a bent connecting section and method for testing and producing said printed circuit board, and also electronic control unit and method for operating said electronic control unit

A circuit board assembly for a control unit of a motor vehicle has a multi-layer circuit board and a plug connector with a housing faceplate. The circuit board, which includes conductor paths for conducting signals, has a first section, a second section, and a flexible third section with a lower stiffness between the first and second sections. The first section encloses an angle &#x3c6; with the second section. The plug connector has a multiplicity of connection elements, each with an attachment part and a contact pin. The housing faceplate has first and second side panels each enclosing an angle &#x3b2; with the first panel central plane and an angle &#x3b3; with the second panel central plane. A first detent element prevents a change in the angle &#x3c6; in a first direction of rotation. A second detent element prevents a change in the angle &#x3c6; in a second direction of rotation.

Circuit board assembly

A method for manufacturing a circuit carrier for electronic components includes making available a carrier material layer made of an electrically insulating material and having at least one connecting layer which is applied at least to a first and/or second surface of the carrier material layer and has in each case a predefined layer thickness. Each connecting layer has a number of electrically conductive connections with a predefined conductor track width. At least some of the connections are strengthened by plasma spraying, at least in certain sections, with additional electrically conductive material. As a result, a greater layer thickness than the predefined layer thickness and/or a larger conductor track width than the predefined conductor track width is obtained. Furthermore, a circuit carrier for electronic components is specified.

Method for reinforcing conductor tracks of a circuit board

A method for producing a lateral connection of an electro-optical interface is specified. In the method, a printed circuit board having a non-curved center plane is provided. An electro-optical component and an electrical component are arranged and oriented with respect to one another in a connection region. A first section of the printed circuit board is deformed in such a way that the center plane encloses an angle with the non-deformed layer in the region of the first section. An electro-optical interface and a control device are also specified.

Method for producing an electro-optical interface, electro-optical interface, and control unit

A plug contact is provided for the provision of a press contact with a mating contact. The plug contact is composed of an electrically conductive material. The plug contact has a first contact section for the provision of the press contact. The first contact section has, at least in places, an electrically conductive organic coating, and the organic coating contains a metal, an alloy, and/or an electrically conductive polymer. A printed circuit board arrangement is also provided.

Plug contact with organic coating and printed circuit board arrangement

A printed circuit board includes at least two rigid printed circuit board parts which are connected to one another by at least one flexible connecting part which is thinner than the rigid printed circuit board parts. The at least two rigid printed circuit board parts can be moved toward one another by bending the flexible connecting part. A groove, which is produced by the different thickness of the rigid printed circuit board parts relative to the flexible connecting part, is filled with an elastic material.

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Bernhardswald, Germany

Detlev Bagung