Motorola Corporation

Starlight Instruments, Inc.

Detlef W Schmidt

Martin Rabindra Pais

Kevin J McDunn

Linda Limper-Brenner

Minoo D Press

John N Lubbe

Kevin Douglas Moore

Carl Missele

Peter A Kwitkowski

Ronald Peter Kochanski

Garron K Morris

Shumin Cheng

Carl Mussele

Greg M Gutierez

An electric motor () for controlling the lateral displacement of a shaft () connected to a rotor () of the electric motor () is provided. The electric motor () includes one or more stator conductors () for carrying a current and one or more permanent magnets () to produce a magnetic field (). The one or more stator conductors () interact with the magnetic field () when the power is applied, to purposely generate a force with an axial (Fa) and a circumferential component (Fc). The electric motor () includes the shaft () that travels along a rotor axis () in an axial direction when the power is applied, under an action of the axial component of the force. However, when the power is removed, the shaft () retracts under the action of a biasing force from a tension device ().

Electric motor with a retractable shaft

A carrier assembly (,) for a circuit board includes a copper insert (,) pressed into an aluminum carrier (,). The copper insert has an undercut recess (,). As the insert (,) is pressed into the carrier (,), a portion of the carrier material is flowed into the undercut recess (,) to provide a firm interlocking of the insert (,) with the carrier (,).

Carrier assembly and method

An improved cooling fan (,) fan for cooling an electronic component includes a rotor (,) rotatably mounted in a housing (,) and having a plurality of fan blades (,). The housing (,) includes a first end (,), a second end (,), and a passage (,) interconnecting the first end and the second end to define an air flow path (,) therebetween. An entry port (,) is defined by an upstream portion of the housing (,) generally adjacent the housing first end (,), with the entry port (,) having a cross-sectional area greater than a cross-sectional area of the passage (,). The entry port (,) and the passage (,) being separated by a transition zone (,), with the entry port (,) and the transition zone (,) cooperating to define an abrupt step (,). The abrupt step (,) is adapted to at least partially affect the flow of air flowing along the flow path (,), thereby reducing the ambient noise level of the fan.

Low-noise cooling fan for electronic components and method of making the same

A device for focusing optical instruments, for example a telescope or microscope, includes a drive assembly having a fine and a coarse control knob. The knobs operatively connect with a drive shaft that extends transversely through a concave shaped support area of the drive. Seated in this support area is a tubular-shaped housing having an opening that fits over the drive shaft. Respective pairs of longitudinally spaced apart bearings then are attached to an inside wall of the housing to proximately align one each with ends of the housing shaft opening. A tubular-shaped drawtube then movably fits in the housing where a friction plate carried by a bottom portion of the drawtube engages the drive shaft. In an outer surface of the drawtube on each side of the friction plate is a longitudinal slot. Each slot has a bottom offset for a self-locating rail. Respective upper flat segments of the rails are in rolling contact with one each of the bearing pairs. During use an eyepiece of the optical instrument, for example, is inserted in a support collar carried inside an outer end of the drawtube. Lens of the eyepiece then are focused by rotation of the drive assembly knobs. The connecting drive shaft moves the drawtube and eyepiece to a position where the eyepiece lens display a distinct image.

Focuser for optical instrument

The substrate (10) has a first side (12) and a second side (14) and includes an insert material (16) having a first thermal conductivity (24) in a first direction (25) and having a second thermal conductivity (26) in a second direction (27). A plurality of vias (30) are formed in the second direction through the insert material and an encapsulant material (18) surrounds the insert material. When an electronic component (22) is disposed on the first side, heat (25) from the electronic component is conducted in the first direction by the insert material and is conducted in the second direction through the plurality of vias.

Hybrid substrate for cooling an electronic component

The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

Process for mounting an electronic component to a substrate and process

Apparatus and method for mounting an electronic component to a substrate

A substrate alignment and retainer clip (10, 20) is provided which includes an anchor (12, 13, 40), a retainer (11, 42), and a biasing device (11, 41), joining and aligning the anchor (12, 13, 40) and retainer (11, 42), for biasing the retainer (11, 42) towards the anchor (12, 13, 40).

Substrate alignment and retainer clip

An apparatus and method (200) for providing a hybrid circuit assembly carrier bracket are included wherein the bracket is constructed and arranged to provide controlled placement of at least a first power transistor (124, 126) and to provide a highly efficient thermal transfer and dissipating arrangement. The bracket is constructed and arranged to provide for placement of at least a first substrate for a hybrid circuit assembly thereon, and includes at least a first power transistor aperture (120, 122) with at least two bracket projections (146, 148) for permitting placement of said transistor on plural electrical contacts (104, 106). The heat generated by components on the circuit board(s) is transferred and dissipated substantially by biasing at least one bracket projection member resiliently against a heat sink (108, 110, 112, 114, 116, 118).

Method for providing novel hybrid circuit assembly carrier bracket

A heat sink-hybrid circuit assembly clamping device (100) and method (200) are provided for minimizing hybrid circuit assembly substrate-transistor solder joint stress. The clamping device is positioned and selected to provide a net coefficient of linear expansion (CLE) substantially of a magnitude equal to a net coefficient of the substrate material such that uniform pressure and contact are obtained between the transistors of hybrid circuit assemblies and the heat sink.

Multiple transistor clamping device and method

Method and apparatus for providing novel hybrid circuit assembly carrier

A solder bump stretch device is disclosed for use in mounting an electronic component to a substrate by a plurality of solder bump interconnections that are produced by reflowing preformed solder bumps carried on the component. the device is fastened to the component, which is in turn assembled with the substrate so that the bumps rest upon the substrate in preparation for solder reflow operations. The device comprises a flexible web that overlies the component outer face and is connected to legs that depend about the component. Prior to solder reflow, the web is held by an expendable spacer in a biased position wherein the legs are raised apart from the substrate. During heating to melt the solder bumps, the spacer is expended, releasing the web, whereupon the legs engage the substrte to lift the component relative to the substrate and thereby stretch the molten solder to form elongated interconnections preferably having hourglass configurations.

Solder bump stretch device

An improved omega connector for electrically coupling components of a multicomponent electronic assembly comprises first and second flat end sections each formed of nonporous copper plate adapted for solder bonding to components, and an intermediate loop section formed of interwoven copper fibers extending between the end sections to provide a continous electrically conductive network therebetween. The fibers in the loop section carry a solder nonwettable coating to avoid interference with bonding operations to attach the end section to the components. Preferably, the loop section is composed of nickel-clad copper fibers. The fibrous loop section exhibits enhanced flexibility to reduce stresses attributed to shifting of the components during operation and thereby extend the useful life of the assembly.

Braided fiber omega connector

A semiconductor device having a plurality of conductive leads extending therefrom is provided for reliably and repeatable positioning and holding a separate electronic device. The conductive leads are disposed apart to provide a predetermined space therebetween. Upstanding sidewall portions of desired dimensions are formed in the conductive leads at a predetermined distance from the central body portion of the semiconductor device. The separate electronic device is inserted in the space between opposite upstanding sidewall portions and is engaged and mechanically held thereby.

Growing community of inventors

Schaumburg, IL, United States of America

Detlef W Schmidt