Vistec Semiconductor Systems Gmbh

Leica Microsystems Semiconductor Gmbh

Kla-tencor Mie Gmbh

Detlef Michelsson

Henning Backhauss

Albert Kreh

Gert Weniger

Daniel Skiera

Steffen Gerlach

Joerg Richter

Bernd Jungmann

Guido Dietzler

An image () of a disc-shaped object () is recorded, wherein the entire surface () is captured with a plurality of fields (). A difference image () is formed, by subtracting a reference from each field () of the surface () of the disc-shaped object (), and subject to a color transformation, wherein by a suitable choice of transformation signals in one channel are maximized, while at the same time undesired variations, caused by production, of the fields () are moved to a different channel. That combination of transformation and detection channel is chosen for which the largest number of pixels of a field () with the defect to be found are located outside the spread of the pixels of the respective field () on the surface () of the respective disc-shaped object () from production and provide the largest signals for the defect.

Method for inspection and detection of defects on surfaces of disc-shaped objects and computer system with a software product for carrying out the method

A method for processing the image data of the surface of a wafer () recorded by at least one camera () is disclosed, wherein an image field () is defined for each camera () in such a way that the recorded image content is repeated after N recorded images. In an evaluation electronics () M utility programs () are determined, wherein M is equal to the number of recorded images after which the image content is repeated. The number M of utility programs () is adapted to the number N of images. Each of the M utility programs () of the plurality of recorded images is only fed with images having the same image contents in order to detect defects on the basis of the image contents of the images of the surface of the wafer. The results of the M utility programs () are respectively forwarded to a central program () in a sequential manner, which compiles a distribution of the defects present on the surface of the wafer () from the individual results of the M utility programs ().

Method and apparatus for processing the image data of the surface of a wafer recorded by at least one camera

The invention relates to a method for inspecting a surface of a wafer with regions of different detection sensitivity. For this purpose, an image of the selected surface of the wafer is acquired using a detector. At least one region handled with a different detection sensitivity than the rest of the wafer may be defined on the surface of the wafer by means of an input unit. The detection sensitivity set for the regions is a percentage less than the detection sensitivity for the surface of the wafer without the regions with the different detection sensitivity.

Method for inspecting a surface of a wafer with regions of different detection sensitivity

The present invention relates to a method for optically inspecting and visualizing optical measuring values from at least one image of a disk-like object, including the steps of recording said at least one image of said at least one disk-like object, wherein a plurality of optical measuring values are produced from said at least one recorded image; generating a resulting image, wherein an area of the surface of said disk-like object having optical measuring values within a predetermined interval, is associated with a color or brightness value selected from a predetermined range; and varying at least one imaging parameter as a function of the detected and evaluated optical measuring values and/or as a function of a visual inspection of the resulting image by an operator.

Method for the optical inspection and visualization of optical measuring values obtained from disk-like objects

A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including the edge bead removal line is imaged on a line-by-line basis, an intensity profile I of the imaged edge area including the edge bead removal line is obtained with a camera on a line-by-line basis, and the edge area and the alignment mark are detected, wherein the local intensity maxima I'of the intensity profile I are plotted as points in a diagram, segment sets are formed in the diagram, the segment sets are fitted in ellipses, and a quality criterion qis determined for each ellipse.

Method for determining the position of the edge bead removal line of a disk-like object

A method of determining defects in a plurality of images having essentially the same image contents is disclosed. A comparison operation is carried out once three fully comparable images having essentially the same image contents are present in the intermediate memory. The stored individual images are accessed randomly. A paired comparison operation between the three difference images is carried out.

Detecting defects by three-way die-to-die comparison with false majority determination

A method of detecting incomplete edge bead removal from a disk-like object is disclosed. First a peripheral area of a disk-like reference object is imaged. Marks are then defined in the peripheral area of the reference object. Finally, images of peripheral areas of a plurality of disk-like objects of the same batch are recorded. The inspection of the disk-like objects is limited to the locations of the marks defined on the reference object.

Method of detecting incomplete edge bead removal from a disk-like object

The invention relates to a method and a device for the optical inspection of the surface of semi-conductor substrate. An image () is captured on the surface of the semi-conductor substrate which is covered with a thin layer. Said image is made of a plurality of pixels having associated colour values and intensities. The frequency distribution of pixels having equal colour co-ordination values is calculated () from the colour values in a colour range (), said colour range having a colour intensity and colour co-ordinates. The thus calculated frequency distribution is used () to compare a second correspondingly calculated frequency distribution or a variable derived therefrom. According to the invention, the colour shift () and/or differences () in the colour distribution are determined according to fluctuations in the intensity of the illumination. The invention also relates to a method and a device for producing a structured semi-conductor substrate by using the above-mentioned method or the above-mentioned device and software for carrying out said method.

Method, device and software for the optical inspection of a semi-conductor substrate

Defects on a wafer () can be detected using bright-field and/or dark-field illumination. The radiation incident onto the wafer () has, in this context, a substantial influence on the reliability of the measurement results. To improve the reliability of the measurement results, the wafer () is illuminated with an illumination device (), adjustment of the illumination device (), in particular its brightness and frequency, being accomplished in consideration of read-out stored illumination setpoints. These illumination setpoints are determined by way of a previous reference measurement.

Method for inspection of a wafer

The invention is based on a method and an apparatus for scanning a semiconductor wafer (), on-the-fly images of regions on the wafer being acquired using a camera (). Upon a scan line changeover, a continuously curved displacement track is generated by at least partial superimposition of the relative motions between the wafer () and camera () in the direction of the scan lines and perpendicular thereto. As a result, time is saved and wafer throughput is increased.

Growing community of inventors

Wetzlar-Naunheim, Germany

Detlef Michelsson