Kuraray Co., Ltd.

Hoechst Celanese Corporation

Other

Detlef M Frank

Toshiaki Sato

Minoru Onodera

Randy Douglas Jester

John Arthur Penoyer

Takeichi Tsudaka

Tohei Moritani

Douglas Duane Roth

Toru Sanefuji

Sherman Hall Rounsville

Edwin Charles Culbertson

Leonard R Garrett, Deceased

Takeichi Tsugaka

A film having a roughened surface. The film is made of an LCP and has surface recessions covering at least about 25% of the area of the surface. The film is made by pressing an embossing means against the film surface at a temperature about 15.degree.-75.degree. C. below the melting point of the polymer. The embossed film has improved resistance to abrasion.

LCP films having roughened surface and process therefor

The invention provides a multilayer microelectronic circuit board including a laminate of a plurality of circuit layers containing conductive vias within the layers or a combination of conductive vias and conductive wiring patterns on a surface of the layers, the layers comprising a first liquid crystal polymer and, interposed between said circuit layers, a layer of second liquid crystal polymer having a melting point of at least about 10.degree. C. lower than the melting point of the first liquid crystal polymer. The boards are produced by stacking a plurality of circuit layer sheets in appropriate electrical alignment such that they are separated by an interposed layer of the second liquid crystal polymer of lower melting point, and heating the stacked polymer sheets under pressure sufficient to bond the sheets or layers into a microelectronic printed circuit board, the temperature of the heating being sufficient to melt the lower melting second polymer but insufficient to melt the polymer present in the circuit layers. The second polymer layer may be interposed as a separate sheet during assembly or may be present as one or two separate surface layers in contact with the higher melting point polymer of the circuit layers.

Monolithic LCP polymer microelectronic wiring modules

A process for treating a liquid crystal polymer film which includes the steps of: heating a film obtained by extrusion molding of a liquid crystal polymer, while contacting at least one surface of the film with a supporting body, to melt the polymer; cooling the melted polymer to form a solidified polymer layer; and separating the solidified polymer layer from the supporting body. The process readily provides liquid crystal polymer films having excellent resistance to intra-layer delamination and high tensile strength and elongation, as well as excellent resistance to abrasion, dimensional stability when heated, and resistance to folding.

Process for treating liquid crystal polymer film

Growing community of inventors

Mainz, Germany

Detlef M Frank