Infineon Technologies Ag

Siemens Aktiengesellschaft

Other

Bundesdruckerei Gmbh

Genua Gmbh

Detlef Houdeau

Manfred Paeschke

Peter Stampka

Michael Huber

Josef Mundigl

Manfred Fries

Josef Heitzer

Josef Kirschbauer

Robert Wilm

Frank Pueschner

Robert Reiner

Jörg Fischer

Bernd Stadler

Helmut F Schlaak

Erik Heinemann

Roland Melzer

Thies Janczek

Frank Arndt

Olaf Dressel

J&uuml;rgen Fischer

Reinhard Fischbach

Frank Püschner

Frank P&uuml;schner

Jurgen Fischer

Lothar Kiesewetter

Hans-Georg Mensch

Hans-Hinnerk Steckhan

Helmut Graf

Richard Scheuenpflug

Jürgen Fischer

Rainer Rettig

Moritz Von Rauch

Christl Niederle

Stefan Emmert

Volker Rohde

Marianne L&ouml;sch

Harald L&ouml;sch

Reinhold Merkl

Christoph Filser

Matthias Ochs

A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

Product label, method of producing product labels and method for identifying products in a contactless and forgery-proof manner

A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one surface of the semiconductor film, contact areas are applied directly. The substrate film is disposed between the semiconductor chip and the contact areas in such a way that it connects the connection points of the semiconductor chip to the contact areas in a manner of a direct contact.

Smart-card module with an anisotropically conductive substrate film

In a smart card module for biometric sensors for installation in smart cards, a support has at least one through opening or window in the region of a sensor chip. The sensor chip is mounted on the support such that an active surface of the sensor chip is directed toward the support and is situated in the region of the window, so that it can be accessed through the window in the support.

Smart card module for biometric sensors

A display unit includes activation or driver electronics disposed on the rear side of a display element. A display unit has a front region with a display element; a rear region, facing away from the front region, with at least one control element for the activation of the at least one display element; and electrical lines for the connection of the at least one display element to the at least one control element. Preferably, an LCD display with a top layer, a liquid crystal layer, and a bottom sheet is used. The control element is disposed on the bottom sheet. The control element is, for example, an unpackaged IC, that is attached to the bottom sheet folded back on itself and is laterally offset in such a way that it cannot overheat the actual LCD display. The electrical lines are preferably conductor tracks on the bottom sheet.

Display unit for chip cards with folded sheet a method for manufacturing such a display unit

A fingertip sensor with a biometric sensor element for detecting fingerprints, the activation or deactivation is effected by touching and releasing the sensor element.

Fingertip sensor with integrated key switch

A chip card module contains, in addition to conductor tracks and a chip carrier, one or more semiconductor chips and, if necessary, a stiffening frame. The semiconductor chip(s) and/or stiffening frame are attached with the aid of an adhesive, with which particles of a defined size are admixed as spacers. The adhesive in preferably a flexible adhesive, and the particles preferably are formed of a deformable material. The invention has the effect that the semiconductor chip(s) and/or stiffening frame are adhesively attached to the underlying surface at a defined, uniform distance. The flexible adhesive and the deformable particles adapt to deformations of the chip card module and thus prevent damage to the adhesively bonded mating surfaces.

Chip card module

A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

Smart card

The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

Sensor device for sensing biometric characteristics, in particular finger minutiae

A carrier element for a semiconductor chip which can be incorporated in smart cards and soldered onto circuit boards using SMD technology. For this purpose, a copper lamination of a plastic sheet is structured by etching in such a way that contact areas are formed in one piece with conductor tracks which end at the edge of the carrier element and enable reliable soldering.

Carrier element for a semiconductor chip

A data card includes a card body having at least one card top layer and at least one card bottom layer. The outer dimensions of the top and bottom card layers correspond to one another, and a module element is fitted in between the card top layer and card bottom layer. The module element has an integrated electronic circuit for processing and/or storing personal data. A levelling compensating layer has a levelling material and is disposed or formed between the module element and the card top layer and/or the card bottom layer for filling existing cavities in the module element or between the module element and the card top layer and/or card bottom layer. The levelling compensating layer also fills or levels existing protruding elevations on a surface of the module element.

Data card, process for manufacturing a data card and apparatus for manufacturing a data card

The chip module is particularly suitable for implanting in a smart card body. The module has a carrier and a chip fitted on the carrier. A pedestal or base-type elevation formed on the carrier laterally surrounds the chip completely or partly.

Chip module, in particular for implantation in a smart card body

A wafer frame for fixing and handling 200 mm wafers is produced with a significantly reduced weight as compared to a metal wafer frame, while maintaining mechanical and thermal material properties. This is accomplished by producing the wafer frame from a plastic with a glass fiber content of from 1 to 40% by weight.

Wafer frame

A data medium in card form has a least one semiconductor memory element with a storage capacity of at least one megabit and has electroplated contacts for transmission of data between a data processing system the semiconductor memory elements of the data medium. Electrical conductor paths on the data medium connect the semiconductor memory element to the electroplated contacts. The electrical conductor paths are a single leadframe on which at least parts of the electroplated contacts are integrally formed. The leadframe is formed of a resilient material.

Data medium in card form and lead frame for use in such a data medium

The invention concerns a process and a connecting arrangement for producing a chip card, wherein a semiconductor chip on a module is fitted in an opening in a card carrier with the attainment of an electrical and mechanical connection. In accordance with the invention, in place of connections which were hitherto necessary involving a force-locking relationship and/or involving the materials being bonded together, recourse is made to inductive and/or capacitive coupling between the module and the IC-card. For that purpose the module and the card correspondingly have coils and/or capacitive coupling surfaces for signal transmission purposes.

Method and connection arrangement for producing a smart card

A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

Smart card module and smart card including a smart card module

Growing community of inventors

Langquaid, Germany

Detlef Houdeau