Siemens Aktiengesellschaft

Detlef Haberland

Helmut Haltenorth

Michael Langenwalter

Werner Spaeth

Klaus Panzer

Herbert Prussas

Franz Taumberger

Michael Kaindl

Ferdinand Frenkel

Lothar Spaeter

Jan Smola

Rudolf Falkenstein

Bernd Seibert

Hans G Rosen

Karl Breuninger

Roland Herberger

An optical separating module is provided with both an interference beam-splitter and a filter layer whose transmission characteristics correspond to each other. Both layers are vapor deposited with the filter layer being deposited on the optical fiber end face which is subsequently to be coupled to an optoelectrical transducer forming a receiver.

Optical separating module

An optoelectronic module is disclosed comprising an optoelectronic component (D), e.g. a photodiode (D) and/or a laser diode (D); a ring (RI) as an optical aperture in a wall of its housing (S/E/P, S/G/W) for the transmission of information-modulated light to or from the component (D) through the housing wall (S) to or from an optical component (L); and a lens system (K) having at least one lens (K), among them, at least one focusing lens (K) encircled by the ring (RI) or at least by a section of the ring (RI). At least one of the lenses (K) consists of glass and is intergrown with the ring (RI), at least in part consisting of glass, so as to be hermetically tight all around forming an intergrowth zone (SZ). Furthermore, the ring (RI) is inserted in the housing wall so as to form a hermetically tight seal.

Optoelectronic module

A glass fiber bushing is provided for a wall opening of a housing which has a light-transmitting or a light receiving component mounted therein, the component having an optically-active location to be optimally coupled to the tip of the glass fiber. At least in the region of the opening through the housing, the glass fiber is firmly surrounded by and is secured in a stiff tube which is inserted through the wall opening. An adjustment member which adjusts the glass fiber position is slipped with a tight clearance over the tube and/or over a transition piece which is secured to the tube. An end face of the adjustment member is oriented toward the exterior surface of the housing in the region surrounding the wall opening. At least close to the tip of the glass fiber, the outer diameter of the glass fiber or of a glass fiber protective layer is surrounded by the inner wall of the tube with so little play that the tube defines the position of the tip of the glass fiber. In a region between the adjustment member and the component the tube is plugged through an elastic membrane of the wall opening. A surface of the membrane is secured to the housing in the area of the wall opening. The end face of the adjustment member which adjusts the position of the tube and, therewith, the position of the glass fiber is secured to the exterior surface of the housing.

Glass fiber bushing through a wall opening of a housing and method of

In an opto-electronic module housing for positioning an end of an optical fiber in a desired position relative to an active area of an opto-electronic component characterized by the housing including an optical fiber connector having an adjustment plane at one end and an arrangement for holding an end of an optical fiber with the axis of the fiber on an axis extending perpendicular to the adjustment plane with the end being a fixed distance from the plane, an adjustment frame being securable to the adjustment plane and an arrangement for locating an opto-electronic component or transducer relative to the frame including a plate having the component mounted thereon. The arrangement including the plate is securable to the frame and the frame and the arrangement enable adjusting the component in three spatial directions relative to the end of the fiber to obtain an optimum adjustable position. The module housing can be received in an outer gas and light-tight housing in which case the connector extends through a wall of a can or member forming part of the outer housing which coacts with a lid to enable access to the interiorly disposed module housing. The component can either be a light-emitting opto-electronic component or a light-opto-electronic receiving component.

Opto-electronic module housing

A form of construction of and a method for fabricating individual conductor paths in hybrid circuits having conductor crossovers are described. Integrated circuit chips forming the crossovers are metallized so that at least the peripheral areas crosswise to the crossed conductor paths are free from metal.

Discrete crossover chips for individual conductor track crossovers in

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Steinebach, Germany

Detlef Haberland