Midwest Research Institute

U.S. Department of Energy

The United States of America as Represented by the United States

Alliance for Sustainable Energy, LLC

Desikan Bharathan

A Vahab Hassani

Vahab Hassani

Kevin Scott Bennion

Kenneth F Kelly

Andreas Vlahinos

Yves Parent

Sreekant Narumanchi

Mark S Bohn

Thomas A Williams

The disclosure provides a fluid-cooled heat sink having a heat transfer base, a shroud, and a plurality of heat transfer fins in thermal communication with the heat transfer base and the shroud, where the heat transfer base, heat transfer fins, and the shroud form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

Fluid-cooled heat sink for use in cooling various devices

The disclosure provides a fluid-cooled heat sink having a heat transfer base and a plurality of heat transfer fins in thermal communication with the heat transfer base, where the heat transfer base and the heat transfer fins form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices

A power module assembly () with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate () with passageways or openings () for coolant that extend through the plate from a lower surface () to an upper surface (). A circuit substrate () is provided and positioned on the spreader plate () to cover the coolant passageways. The circuit substrate () includes a bonding layer () configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer () may be solder material which bonds to the upper surface () of the plate to provide a continuous seal around the upper edge of each opening () in the plate. The assembly includes power modules () mounted on the circuit substrate () on a surface opposite the bonding layer (). The power modules () are positioned over or proximal to the coolant passageways.

Low thermal resistance power module assembly

A stratified vapor generator () comprises a first heating section (H) and a second heating section (H). The first and second heating sections (H, H) are arranged so that the inlet of the second heating section (H) is operatively associated with the outlet of the first heating section (H). A moisture separator () having a vapor outlet () and a liquid outlet () is operatively associated with the outlet () of the second heating section (H). A cooling section (C) is operatively associated with the liquid outlet () of the moisture separator () and includes an outlet that is operatively associated with the inlet of the second heating section (H).

Stratified vapor generator

A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.

A computational modeling method for predicting the chemical, physical, and thermodynamic performance of a condenser using calculations based on equations of physics for heat, momentum and mass transfer and equations of equilibrium thermodynamics to determine steady state profiles of parameters throughout the condenser. The method includes providing a set of input values relating to a condenser including liquid loading, vapor loading, and geometric characteristics of the contact medium in the condenser. The geometric and packing characteristics of the contact medium include the dimensions and orientation of a channel in the contact medium. The method further includes simulating performance of the condenser using the set of input values to determine a related set of output values such as outlet liquid temperature, outlet flow rates, pressures, and the concentration(s) of one or more dissolved noncondensable gas species in the outlet liquid. The method may also include iteratively performing the above computation steps using a plurality of sets of input values and then determining whether each of the resulting output values and performance profiles satisfies acceptance criteria.

Method for analyzing the chemical composition of liquid effluent from a direct contact condenser

A direct contact condenser having a downward vapor flow chamber and an upward vapor flow chamber, wherein each of the vapor flow chambers includes a plurality of cooling liquid supplying pipes and a vapor-liquid contact medium disposed thereunder to facilitate contact and direct heat exchange between the vapor and cooling liquid. The contact medium includes a plurality of sheets arranged to form vertical interleaved channels or passageways for the vapor and cooling liquid streams. The upward vapor flow chamber also includes a second set of cooling liquid supplying pipes disposed beneath the vapor-liquid contact medium which operate intermittently in response to a pressure differential within the upward vapor flow chamber. The condenser further includes separate wells for collecting condensate and cooling liquid from each of the vapor flow chambers. In alternate embodiments, the condenser includes a cross-current flow chamber and an upward flow chamber, a plurality of upward flow chambers, or a single upward flow chamber. The method of use of the direct contact condenser of this invention includes passing a vapor stream sequentially through the downward and upward vapor flow chambers, where the vapor is condensed as a result of heat exchange with the cooling liquid in the contact medium. The concentration of noncondensable gases in the resulting condensate-liquid mixtures can be minimized by controlling the partial pressure of the vapor, which depends in part upon the geometry of the vapor-liquid contact medium. In another aspect of this invention, the physical and chemical performance of a direct contact condenser can be predicted based on the vapor and coolant compositions, the condensation conditions. and the geometric properties of the contact medium.

Method and apparatus for high-efficiency direct contact condensation

The present invention is a system and method for simulating the performance of a cooling tower. More precisely, the simulator of the present invention predicts values related to the heat and mass transfer from a liquid (e.g., water) to a gas (e.g., air) when provided with input data related to a cooling tower design. In particular, the simulator accepts input data regarding: (a) cooling tower site environmental characteristics; (b) cooling tower operational characteristics; and (c) geometric characteristics of the packing used to increase the surface area within the cooling tower upon which the heat and mass transfer interactions occur. In providing such performance predictions, the simulator performs computations related to the physics of heat and mass transfer within the packing. Thus, instead of relying solely on trial and error wherein various packing geometries are tested during construction of the cooling tower, the packing geometries for a proposed cooling tower can be simulated for use in selecting a desired packing geometry for the cooling tower.

Method and system for simulating heat and mass transfer in cooling towers

A hybrid combined cycle power plant including a solar central receiver for receiving solar radiation and converting it to thermal energy. The power plant includes a molten salt heat transfer medium for transferring the thermal energy to an air heater. The air heater uses the thermal energy to preheat the air from the compressor of the gas cycle. The exhaust gases from the gas cycle are directed to a steam turbine for additional energy production.

Hybrid solar central receiver for combined cycle power plant

A vertical tube flash evaporator for introducing a superheated liquid into a flash evaporation chamber includes a vertical inlet tube with a flared diffuser portion at its upper outlet end. A plurality of annular screens are positioned in axially spaced-apart relation to each other around the periphery of the vertical tube and below the diffuser portion thereof. The screens are preferably curved upward in a cup-shaped configuration. These flash evaporators are shown in an ocean thermal energy conversion unit designed for generating electric power from differential temperature gradients in ocean water. The method of use of the flash evaporators of this invention includes flowing liquid upwardly through the vertical tube into the diffuser where initial expansion and boiling occurs quite violently and explosively. Unvaporized liquid sheets and drops collide with each other to enhance surface renewal and evaporation properties, and liquid flowing over the outlet end of the diffuser falls onto the curved screens for further surface renewal and evaporation.

Growing community of inventors

Lakewood, CO, United States of America

Desikan Bharathan