Beijing Haiju Electronic Technology Co., Ltd.

Deshu Niu

Haiwei Sun

Jie Xu

Caizheng Zhang

Jingchao Fan

This invention introduces a pneumatic chip transfer mechanism for laser ungluing needles in the semiconductor optoelectronic field. It comprises upper and lower platform mobile systems, and a central transfer platform system equipped with a transfer slide, vertical power module, needle clamping bracket, and a laser-assisted needle assembly. This assembly includes a laser section with a window, a pneumatic section with an inlet hole, and a micro-hole needle aimed at the blue film assembly on the lower platform. A camera assembly, laser bracket, and laser generator are also integral parts. The mechanism employs a laser generator to modify blue film material properties, creating a bubble that facilitates chip detachment onto a target substrate. This design ensures efficient, flexible Mini/Micro LED chip transfers, revolutionizing chip detachment methods with its innovative approach to leveraging laser and pneumatic technologies for optimal performance.

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Beijing, China

Deshu Niu