Honeywell International Inc.

Magna Mirrors of America, Inc.

Desaraju Varaprasad

Niall R Lynam

Songyuan Xie

David Nalewajek

Ian A McCabe

Sudip Mukhopadhyay

Ronald R Katsanes

Awdhoot V Kerkar

Joseph T Kennedy

Boris Korolev

Amanuel H Gebrehrhan

Hai Bien

A method for preventing the collapse of patterned, high aspect ratio features formed in semiconductor substrates upon removal of wash solutions of the type used to clean etch residues from the spaces between the features. In the present method, the spaces are at least partially filled with a displacement solution, such as via spin coating, to substantially displace the wash solution. The displacement solution includes at least one solvent and at least one fill material which is a polyalkene carbonate (PAC) and/or a saccharide. The solvent is then volatized to deposit the fill material in substantially solid form within the spaces. The fill material may be removed by thermal degradation via heat treatment, wherein the need for removal of the fill material by plasma ashing is obviated in order to prevent or mitigate silicon loss.

Thermally removable fill materials for anti-stiction applications

A method for preventing the collapse of patterned, high aspect ratio features formed in semiconductor substrates upon removal of an initial fluid of the type used to clean etch residues from the spaces between the features. In the present method, the spaces are at least partially filled with a displacement solution, such as via spin coating, to substantially displace the initial fluid. The displacement solution includes at least one solvent and at least one, or combination of, a first fill material in the form of a phenol-formaldehyde polymer and/or a second fill material in the form of a polyalkene carbonate (PAC). The solvent is then volatized to deposit the fill materials in substantially solid form within the spaces. The fill materials may be removed by known plasma etch process via a high etch rate as compared to use of current fill materials, which prevents or mitigates silicon loss.

Fill material to mitigate pattern collapse

A crosslinkable composition includes a first silicon-containing resin comprising alkyl groups and alkyl groups and a second silicon-containing resin comprising alkyl groups. The first silicon-containing resin has a weight average molecular weight from 1000 AMU to 10,000 AMU. The second silicon-containing resin has a weight average molecular weight from 900 AMU to 5000 AMU. The composition further includes at least one solvent and at least one heat-activated catalyst.

Polysiloxane formulations and coatings for optoelectronic applications

A composition is provided including a resin including one or more silicon-based materials, one or more organic-based materials, or a combination of silicon-based materials and organic-based materials. The composition further includes a first solvent having a boiling point from 140&#xb0; C. to 250&#xb0; C. and a second solvent having a boiling point from 50&#xb0; C. to 110&#xb0; C., wherein the a weight ratio of the first solvent to the second solvent is from 1:1 to 1:5. Methods for applying coatings to substrates are also provided.

Materials and spin coating methods suitable for advanced planarization applications

A method for temporarily protecting a semiconductor device wafer during processing includes preparing a solution including poly(vinyl alcohol) and water, coating the device wafer with the prepared solution, baking the coated device wafer to form a protective layer, processing the baked device wafer, and dissolving the protective layer from the processed wafer with a solvent at a temperature not less than 65&#xb0; C. The solvent includes water. The baking is at a temperature from 150&#xb0; C. to 170&#xb0; C. The protective layer remains on the baked device wafer during processing. The poly(vinyl alcohol) has a degree of hydrolysis greater than or equal to 93%.

Removable temporary protective layers for use in semiconductor manufacturing

Provided herein is a reflective optical construction containing a fluoropolymer barrier layer, wherein the fluoropolymer is selected from the group consisting of homopolymers and copolymers of at least one tetrafluoropropene or pentafluoropropene, preferably 2,3,3,3-tetrafluoropropene. Also disclosed is a method of forming a reflective optical construction including (a) applying a barrier layer comprising one or more fluoropolymers selected from the group consisting of homopolymers and copolymers of at least one tetrafluoropropene or pentafluoropropene, and (b) curing.

Barrier materials for mirror assemblies

Anti-reflective coatings and coating formulations, optical elements and processes for preparing coating formulations and optical elements are described. The coating formulations are formed from at least one alkoxysilane material and at least one high boiling solvent. The coating formulation may be applied using roller coat processes.

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Dublin, CA, United States of America

Desaraju Varaprasad