Apple Inc.

Derryk C Davis

Jonathan P Ive

Duncan Robert Kerr

Bartley K Andre

Richard P Howarth

Eugene Antony Whang

Peter N Russell-Clarke

Christopher J Stringer

Martha Evans Hankey

Rico L Zorkendorfer

Daniele De Iuliis

Daniel J Coster

Jody R Akana

Matthew Dean Rohrbach

Jeremy D Bataillou

Julian Hoenig

Shota Aoyagi

Benjamin Andrew Shaffer

Anthony Michael Ashcroft

Mikael M Silvanto

Houtan R Farahani

Ari P Miller

Matthew William Blum

Stephen Vincent Jayanathan

Edward T Sweet

David Phillip Tarkington

Christine A Laliberte

John M Brock

Peteris K Augenbergs

Jonah Alexander Harley

Dhaval Chandrakant Patel

Scott J McEuen

Brandon Pierquet

Ashish K Sahoo

Javier Ruiz

Integrated power modules according to the present technology may include a printed circuit board characterized by a first surface and a second surface. The integrated power modules may include one or more surface-mounted components coupled with the first surface of the printed circuit board. The integrated power modules may include a heat-transfer substrate. The integrated power modules may include one or more gallium nitride transistors coupled between and soldered to each of the second surface of the printed circuit board and the heat-transfer substrate. The integrated power modules may include one or more spacers coupled between and soldered to each of the printed circuit board and the heat-transfer substrate.

Integrated GaN power module

Component of an electronic device

Embodiments disclosed herein relate to an apparatus that provides structural support and an electrical ground for components of an electronic device. Specifically, one or more embodiments of the present disclosure provide a semi-rigid member having at least one screw boss. An electronic component is coupled to the semi-rigid member. In embodiments, the electronic component is coupled to the semi-rigid member using the at least one screw boss. As a separate component, the semi-rigid member is configured to provide an electrical ground for the electronic component and also provides structural support for the electronic component.

Structural ground reference for an electronic component of a computing device

A haptic feedback assembly includes interconnections for mechanically and electrically securing a haptic actuator in a track pad assembly so as to securely and efficiently provide haptic feedback to a user.

Haptic feedback assembly

Growing community of inventors

Cupertino, CA, United States of America

Derryk C Davis