Adesto Technologies Corporation

Derric Lewis

Shane Charles Hollmer

John Dinh

Gideon Intrater

Bard Pedersen

Venkatesh P Gopinath

Stephen Trinh

Nad Edward Gilbert

John Ross Jameson

Juan Pablo Saenz Echeverry

Nathan Gonzales

Ming Sang Kwan

Deepak Kamalanathan

Daniel Wang

Foroozan Sarah Koushan

Michael Van Buskirk

Janet Wang

Vasudevan Gopalakrishnan

A method of controlling a memory device can include: receiving, by an interface, a write command from a host; beginning execution of a write operation on a first array plane of a memory array in response to the write command, where the memory array includes a plurality of memory cells arranged in a plurality of array planes; receiving, by the interface, a read command from the host; reconfiguring the write operation in response to detection of the read command during execution of the write operation; beginning execution of a read operation on a second array plane in response to the read command; and restoring the configuration of the write operation after the read operation has at least partially been executed.

Concurrent read and reconfigured write operations in a memory device

A method of controlling an ultra-deep power down (UDPD) mode in a memory device, can include: receiving a write command from a host via an interface; beginning a write operation on the memory device to execute the write command; reading an auto-UDPD (AUDPD) configuration bit from a status register; completing the write operation on the memory device; automatically entering the UDPD mode upon completion of the write operation in response to the AUDPD configuration bit being set; and entering a standby mode upon completion of the write operation in response to the AUDPD configuration bit being cleared.

Ultra-deep power down mode control in a memory device

A memory device operable in an ultra-deep power-down mode can include: a command user interface; a voltage regulator having an output that provides a supply voltage for a plurality of components of the memory device, where the plurality of components comprises the command user interface; a wake-up circuit that remains powered on even when the memory device is in the ultra-deep power-down mode; the memory device being operable to enter the ultra-deep power-down mode in response to receiving a first predetermined command that causes the output of the voltage regulator to be disabled to completely power down the plurality of components during the ultra-deep power-down mode; and the memory device being operable to exit the ultra-deep power-down mode in response to receiving one of a hardware reset command sequence, a reset pin assertion, a power supply cycling, and a second predetermined command.

Memory device ultra-deep power-down mode exit control

A method of controlling an NVM device can include: (i) receiving, by an interface, a write command from a host; (ii) beginning execution of a write operation on a first array plane of a memory array in response to the write command, where the memory array includes a plurality of NVM cells arranged in a plurality of array planes; (iii) receiving, by the interface, a read command from the host; (iv) suspending the write operation in response to detection of the read command during execution of the write operation; (v) beginning execution of a read operation on a second array plane in response to the read command; and (vi) resuming the write operation after the read operation has at least partially been executed.

Concurrent read and write operations in a serial flash device

In one embodiment, a semiconductor memory device includes a plurality of resistive switching memory cells, where each resistive switching memory cell can include: (i) a programmable impedance element having an anode and a cathode; (ii) an access transistor having a drain coupled to a bit line, a source coupled to the programmable impedance element cathode, and a gate coupled to a word line; (iii) a well having a first diffusion region configured as the source, a second diffusion region configured as the drain, and a third diffusion region configured as a well contact; and (iv) a diode having a cathode at the second diffusion region, and an anode at the third diffusion region, where the diode is turned on during an erase operation on the programmable impedance element.

Resistive switching memory having a resistor, diode, and switch memory cell

In one embodiment, a capacitive circuit can include: (i) a resistive storage element having a solid electrolyte, a first electrode coupled to a first side of the solid electrolyte, and a second electrode coupled to a second side of the solid electrolyte; (ii) the resistive storage element being configured to be programmed to a low resistance state by application of a program voltage in a forward bias direction to form a conductive path between the first and second electrodes, and being configured to be erased to a high resistance state by application of an erase voltage in a reverse bias direction to substantially dissolve the conductive path; and (iii) a first capacitor having the first electrode coupled to a first side of a first oxide layer, and a third electrode coupled to a second side of the first oxide layer.

Capacitor arrangements using a resistive switching memory cell structure

Structures and operations of a resistive switching memory device are described herein. In one embodiment, a resistive switching memory device can include: a plurality of resistive memory cells, each configured to be programmed to a low resistance state by application of a first voltage in a forward bias direction, and erased to a high resistance state by application of a second voltage in a reverse bias direction; a plurality of common plates, each being connected to a subset of the resistive memory cells; a command detector configured to detect a write command to be executed as a first and second write operations; and a write controller configured to perform the first write operation on each resistive memory cell in a selected subset, and to perform the second write operation on at least one of the resistive memory cells in the selected subset based on the detected write command.

Common plate switching reduction in resistive switching memory devices

Structures and methods for control of an operating window of a programmable impedance element are disclosed herein. In one embodiment, a semiconductor memory device can include: (i) a memory array having a programmable impedance element; (ii) a register configured to be programmed with data that represents an erase verify value, a program verify value, and a read trip point resistance value, for the memory array; (iii) a controller configured to determine a mode of operation for the memory array; (iv) a register access circuit configured to read the register to obtain data that corresponds to the mode of operation; and (v) a voltage generator configured to generate a reference voltage based on the register data, where the reference voltage is used to perform an operation on the programmable impedance element corresponding to the mode of operation.

Programmable window of operation for CBRAM

Structures and methods for recovering data in a semiconductor memory device are disclosed herein. In one embodiment, a method of recovering data in a semiconductor memory device, can include: (i) pre-conditioning a first memory cell on the semiconductor memory device by using a formation voltage to program a first data state in the first memory cell; (ii) storing a second data state in a second memory cell on the semiconductor memory device by maintaining the second memory cell in a virgin state; (iii) mounting the semiconductor memory device on a printed-circuit board (PCB) by using a high temperature process that increases a resistance of the first memory cell; and (iv) performing a recovery of the first data state by reducing the resistance of the first memory cell.

Safeguarding data through an SMT process

Structures and methods for controlling operation of a programmable impedance element are disclosed herein. In one embodiment, a method of controlling a programmable impedance element can include: (i) receiving a program or erase command to be executed on the programmable impedance element; (ii) selecting an operation algorithm for executing the command, where the operation algorithm is selected from among a plurality of operation algorithms by decoding at least two bits stored in a register; (iii) determining, using the register, a plurality of option variables for the selected operation algorithm, where the option variables are used to set conditions for one or more of a plurality of program and erase operations of the selected operation algorithm; and (iv) executing the command on the programmable impedance element by performing the one or more of the plurality of program and erase operations of the selected operation algorithm.

CBRAM/ReRAM with improved program and erase algorithms

A memory device can include a plurality of programmable elements; at least one sense circuit that generates sense data values from detected impedances of accessed programmable elements; and at least one data store circuit that stores initial data values from the at least one sense circuit, and stores output data values from the at least one sense circuit after check conditions have been applied to at least one programmable element. The check conditions can induce a change in impedance for programmable elements programmed to at least one predetermined state. Methods can include reading data from at least one memory cell of a memory device comprising a plurality of such memory cells; if the read data has a first value, providing such data as an output value; and if the read data has a second value, repeating access to the memory cell to confirm the read data value.

Growing community of inventors

Sunnyvale, CA, United States of America

Derric Lewis