Koninklijke Philips Corporation N.v.

Nxp B.v.

Philips Image Guided Therapy Corporation

U.S. Philips Corporation

Ipdia

St-Ericsson Sa

Telefonaktiebolaget Lm Ericsson (Publ)

Murata Integrated Passive Solutions

Philips Intellectual Property & Standards Gmbh

Derk Reefman

Johan Hendrik Klootwijk

Freddy Roozeboom

Arjen Van Der Horst

Jaap Ruigrok

David H Burkett

Alphons Antonius Maria Lambertus Bruekers

Erwin Janssen

Joseph James Hoffman

Alfons Wouter Groenland

Cesar Perez

Petrus Antonius Cornelis Maria Nuijten

Ronald Dekker

Mareike K Klee

Achim Hilgers

Xianrui Huang

Antonius Adriaan Maria Staring

Peter Dirksen

Johannes Adrianus Overweg

Eberhard Waffenschmidt

Willem Franke Pasveer

Klaus Reimann

Pieter Gerrit Blanken

Lukas Frederik Tiemeijer

Olaf Wunnicke

Hendrik Johannes Bergveld

Gerald Lea Litzza

Franciscus Lucas Antonius Johannes Kamperman

Marinus Johannes Adrianus Maria Van Helvoort

Engel Johannes Knibbe

Roger Peter Anna Delnoij

Biju Kumar Sreedharan Nair

Philip Alexander Jonas

James Howard Kralick

Gerardus Bernardus Jozef Mulder

Ruediger Mauczok

Henri Marie Joseph Boots

Giuseppe Grillo

Matthew Voss

Bjoern Weissler

Christina Adriana Renders

Bernardus Antonius Maria Zwaans

Ralf Burdenski

Augustus Josephus Elizabeth Maria Janssen

Marinus J A M Van Helvoort

Adrianus Johannes Maria Van Tuijl

Lambertus De Vries

Antonius L A M Kemmeren

Remco Alphonsus Hendrikus Breen

Joshua Kent Hilderbrand

Johannes F C M Verhoeven

Pieter Gerrit Blanden

William Jacques Jean Rey

Raf L J Roovers

Petrus H L Notten

Harry Van Esch

Marco De Wild

Chris Van Heesch

Pieter G Blanken

Gerald Litzza

David Holt Burkett

A wireless intraluminal imaging device and an associated system are provided. In one embodiment, the wireless intraluminal imaging device includes a flexible elongate member including a proximal portion and a distal portion; an ultrasound imaging component coupled to the distal portion of the flexible elongate member; a cable coupled to the ultrasound imaging component and extending along the flexible elongate member; and a wireless communication component coupled to the proximal portion of the flexible elongate member, the wireless communication component in communication with the ultrasound imaging component via the cable. The wireless communication component wirelessly transmits ultrasound echo signals collected by the ultrasound imaging component to an image processing system via a wireless link for image generation at the image processing component.

Wireless intraluminal imaging device and associated devices, systems, and methods

A wireless intraluminal device () and an associated system for treating and diagnosing patients are provided. In one embodiment, the wireless intraluminal device () includes a flexible elongate member () including a proximal portion () and a distal portion (); a sensor assembly () coupled to the distal portion of the flexible elongate member; a cable () coupled to the sensor assembly and extending along the flexible elongate member; and a wireless transceiver () positioned within the flexible elongate member, wherein the wireless transceiver is in communication with the sensor assembly via the cable. A wireless communication component () wirelessly transmits a sensor measurement collected by the sensor assembly to a sensor measurement processing system () via a wireless link () for physiological data generation at the sensor measurement processing system.

Wireless intraluminal device and system

An apparatus includes at least a first electrically conductive coil having at least first and second coil sections which are separated and spaced apart from each other, and a support structure disposed to support the first and second coil sections. The support structure, and an associated method of supporting the electrically conductive coil, maintain relative axial positions of the first and second coil sections to be fixed when the first electrically conductive coil is energized and de-energized, and allow each of the first and second coil sections to expand radially when energized.

Superconducting coil support device and method and apparatus including superconducting coil support device

The invention relates to a nuclear magnetic resonance imaging apparatus comprising: a main magnet () adapted for generating a main magnetic field; at least one radio frequency receiver coil unit () for acquiring magnetic resonance signals in a receiver coil radio frequency band () from an examined object (); means () for inductively (wirelessly) supplying electric power to an electric component of the apparatus, wherein the electric component is adapted to be powered by inductively supplied electric power, wherein the power transfer frequency () and the higher-harmonics () of the power transfer frequency () for inductively supplying the electric power are located outside the receiver coil radio frequency band ().

Inductively powered electric component of an MRI apparatus

An integration substrate for a system in package comprises a through-substrate via and a trench capacitor wherein with a trench filling that includes at least four electrically conductive capacitor-electrode layers in an alternating arrangement with dielectric layers. &#x2014;The capacitor-electrode layers are alternatingly connected to a respective one of two capacitor terminals provided on the first or second substrate side. The trench capacitor and the through-substrate via are formed in respective trench openings and via openings in the semiconductor substrate, which have an equal lateral extension exceeding 10 micrometer. This structure allows, among other advantages, a particularly cost-effective fabrication of the integration substrate because the via openings and the trench openings in the substrate can be fabricated simultaneously.

Integration substrate with a ultra-high-density capacitor and a through-substrate via

In a wireless communications system, such as a multiband Ultra Wideband communications system, data is transmitted by means of the phases of pulses in multiple frequency bands. A signal is transmitted with a predetermined phase in at least one of the frequency bands for at least a part of the time, and can be used to allow accurate detection of the phases of the signals transmitted in the other frequency bands. One of the frequency bands can be designated as a reference band, and pulses can be transmitted with constant phase in the reference band. More generally, pulses can be transmitted in the other frequency bands with phases which have a known relationship with the phases of the pulses in the reference band.

Pulse modulation and demodulation in a multiband UWB communication system

An electronic device is provided which comprises a DC-DC converter. The DC-DC converter comprises at least one solid-state rechargeable battery (B, B) for storing energy for the DC-DC conversion and an output capacitor (C).

Charge pump DC-DC converter comprising solid state batteries

The present invention relates to a configurable trench multi-capacitor device comprising a trench in a semiconductor substrate. The trench has a lateral extension exceeding 10 micrometer and a trench filling includes a number of at least four electrically conductive capacitor-electrode layers. A switching unit is provided that comprises a plurality of switching elements electrically interconnected between different capacitor-electrode layers of the trench filling. A control unit is connected with the switching unit and configured to generate and provide to the switching unit respective control signals for forming a respective one of a plurality of multi-capacitor configurations using the capacitor-electrode layers of the trench filling.

DC-to-DC converter comprising a reconfigurable capacitor unit

The present invention provides a means to integrate planar coils on silicon, while providing a high inductance. This high inductance is achieved through a special back- and front sided shielding of a material. In many applications, high-value inductors are a necessity. In particular, this holds for applications in power management. In these applications, the inductors are at least 5 of the order of 1 &#x3bc;H, and must have an equivalent series resistance of less than 0.1&#x3a9;. For this reason, those inductors are always bulky components, of a typical size of 2&#xd7;2&#xd7;1 mm 3, which make a fully integrated solution impossible. On the other hand, integrated inductors, which can monolithically be integrated, do exist. However, these inductors suffer either from low inductance values, or 10 very-high DC resistance values.

Planar, monolithically integrated coil

The chip comprises a network of trench capacitors and an inductor, wherein the trench capacitors are coupled in parallel with a pattern of interconnects that is designed so as to limit generation of eddy current induced by the inductor in the interconnects. This allows the use of the chip as a portion of a DC-DC converter, that is integrated in an assembly of a first chip and this&#x2014;second chip. The inductor of this integrated DC-DC converter may be defined elsewhere within the assembly.

Assembly, chip and method of operating

A transducer () is provided where a membrane () is formed over a front substrate (); and a piezoelectric layer () is formed over the membrane () at an active portion () and peripheral portions located adjacent the active portion (). A patterned conductive layer including first and second electrodes () is formed over the piezoelectric layer (). Further, a back substrate structure is provided having supports () located at the peripheral portions adjacent the active portion (). The height () of the supports () is greater than a combined height () of the patterned piezoelectric layer and the patterned conductive layer. Many transducers may be connected to form an array, where a controller may be provided for controlling the array, such as steering a beam of the array, and processing signals received by the array, for presence or motion detection and/or imaging, for example.

Thin film detector for presence detection

An electronic device includes at least one trench capacitor that can also take the form of an inverse structure, a pillar capacitor. An alternating layer sequence of at least two dielectric layers and at least two electrically conductive layers is provided in the trench capacitor or on the pillar capacitor, such that the at least two electrically conductive layers are electrically isolated from each other and from the substrate by respective ones of the at least two dielectric layers. A set of internal contact pads is provided, and each internal contact pad is connected with a respective one of the electrically conductive layers or with the substrate. A range of switching opportunities is opened up that allows tuning the specific capacitance of the capacitor to a desired value.

Integrated capacitor arrangement for ultrahigh capacitance values

A power supply system comprises a parallel arrangement of a first switched mode power supply () which has a first system bandwidth (LB) and a second switched mode power supply () which has a second system bandwidth (LB) covering higher frequencies than the first system bandwidth (LB). The first switched mode power supply () is dimensioned to supply a first maximal output power (P), the second switched mode power supply () is dimensioned to supply a second maximal output power (P) being smaller than the first maximal output power (P). A control circuit () varies a reference voltage (Vr) of both the first switched mode power supply () and the second switched mode power supply () to obtain a corresponding variation of an output voltage (Vout) of the parallel arrangement.

Parallel arranged power supplies

Consistent with an example embodiment a, DA-converter system comprises the cascade of a multi-bit sigma-delta modulator and a DA-converter. The quantization noise of the sigma-delta modulator is isolated; the isolated quantization noise is word-length reduced in a second noise shaper with frequency independent signal transfer function and the isolated word-length reduced quantization noise is subtracted from the quantization noise of said cascade. In another embodiment, the isolated quantization noise is amplified before and attenuated after the second noise shaper.

DA-converter system and a method for converting a multi-bit digital signal to an analog signal

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Eindhoven, Netherlands

Derk Reefman