International Business Machines Corporation

Derick Gardner Behrends

Travis Reynold Hebig

Todd Alan Christensen

Daniel Mark Nelson

Michael Launsbach

Chad Allen Adams

Anthony Gus Aipperspach

Ryan Charles Kivimagi

Jesse Daniel Smith

Peter Thomas Freiburger

Jeffrey Milton Scherer

John Edward Sheets, Ii

Igor Arsovski

Juergen Pille

David W Siljenberg

Otto M Wagner

Sebastian Ehrenreich

George Francis Paulik

Chihhung Liao

Robert N Krentler

Jayson K Wittrup

A system and integrated circuits are provided for determining performance metrics over a plurality of cycles of an input signal using on-chip diagnostic circuitry. The system comprises a trigger generation module configured to generate a trigger signal, and diagnostic circuitry coupled with the trigger generation module. The diagnostic circuitry comprises a memory comprising a plurality of data lines, and a plurality of delay elements, each delay element of the plurality of delay elements connected between consecutive data lines of the plurality of data lines. The diagnostic circuitry is configured to receive at least one input signal, and write, upon receiving the trigger signal, values on the plurality of data lines to the memory, thereby acquiring samples of a plurality of cycles of the input signal.

On-chip diagnostic circuitry monitoring multiple cycles of signal samples

A computing system, processing unit, and method are disclosed for detecting a maximum voltage power supply for performing memory testing. The method includes generating, using a sense amplifier of a processing unit and based on a timing of a received pulse signal, first and second drive signals that collectively indicate which of first and second voltages is greater, the first and second voltages produced by respective first and second power supplies. The method also includes coupling, based on the first and second drive signals, the power supply corresponding to the relatively greater voltage of the first and second voltages with the memory.

Detecting maximum voltage between multiple power supplies for memory testing

An electrostatic discharge (ESD) protection device to manage leakage current can, in response to a power good (PGOOD) signal, draw the gate terminal of an ESD clamp device to a voltage below ground. The device also drives an inverted copy of the PGOOD signal to a gated inverter, which can inhibit the gated inverter output from drawing the ESD clamp device gate terminal to ground. The ESD protection device also includes the ESD clamp device to, in response to the gate terminal of the ESD clamp device being drawn to a bias voltage less than ground, allow a leakage current to flow through the ESD clamp device that is less than a leakage current allowed to flow in response to the ESD clamp device gate terminal being drawn to ground.

Electrostatic discharge protection device with power management

A method and circuit for implementing enhanced performance dynamic evaluation, and a design structure on which the subject circuit resides are provided. The dynamic evaluation circuit includes a combined precharge and keeper device connected to a precharge node. The dynamic evaluation circuit includes control logic providing a control input to the combined precharge and keeper device. The combined precharge and keeper device responsive to the control input holds the precharge node precharged when the precharge node is not discharged early in an evaluate cycle.

Implementing enhanced performance dynamic evaluation circuit by combining precharge and delayed keeper

A level shifter circuit for coupling a first circuit, that uses a first supply voltage, with a second circuit, that uses a second supply voltage, includes an input node to receive an input signal and an output node to output to a level-shifted output signal corresponding with the input signal. An idle state on the input node corresponds with a particular binary logic value that is maintained for a first time period, and which is detected by a detection sub-circuit. Further, the level shifter circuit includes a first inverter that uses the second supply voltage, and has a feedback path between the input and output of the first inverter. The feedback path includes a first resistive element and a first transmission gate. The first transmission gate is configurable to open the feedback path when the detection sub-circuit detects an idle state on the input node of the level shifter circuit.

Level shifter for a time-varying input

A TCAM may have a plurality of rows of cells. Each row may have a match line. Each cell may have elements for storing first and second bits, and compare circuitry associated to determine matches between a bit of a search word and data stored in the cell. For at least one first row of the rows, the TCAM includes a valid row cell having at least one element to store a partial update indication. The valid row cell may cause the match line associated with the first row to signal that the first row does not match a search word when the partial update indication associated with the first row is enabled. When the partial update indication associated with the first row is disabled, the determination of matches with a search word is performed solely by the compare circuitry without influence of the valid row cell.

Partial update in a ternary content addressable memory

A semiconductor device may include a through substrate via (TSV) conductive structure that may extend vertically through two or more layers of the semiconductor device. The TSV conductive structure may be coupled to a first voltage supply. The semiconductor device may include substrate layer. The substrate layer may include a first dopant region and a second dopant region. The first dopant region may be coupled to a second voltage supply. The second dopant region may be in electrical communication with the TSV conductive structure. The semiconductor device may include a first metal layer and a first insulator layer disposed between the substrate layer and the first metal layer. The first metal layer may laterally contact the TSV conductive structure. The first and second voltage supply may be adapted to create a capacitance at a junction between the first dopant region and the second dopant region.

Integrated decoupling capacitor utilizing through-silicon via

A semiconductor chip has shapes on a particular level that are small enough to require a first mask and a second mask, the first mask and the second mask used in separate exposures during processing. A circuit on the semiconductor chip requires close tracking between a first and a second FET (field effect transistor). For example, the particular level may be a gate shape level. Separate exposures of gate shapes using the first mask and the second mask will result in poorer FET tracking (e.g., gate length, threshold voltage) than for FETs having gate shapes defined by only the first mask. FET tracking is selectively improved by laying out a circuit such that selective FETs are defined by the first mask. In particular, static random access memory (SRAM) design benefits from close tracking of six or more FETs in an SRAM cell.

Layout to minimize FET variation in small dimension photolithography

A static random access memory (SRAM) having two or more SRAM memory cells connected with a write bit line (WBL) and a write bit line complement (WBLC) is disclosed. The SRAM may include a write driver logic coupled to the WBL and the WBLC. The write driver logic is adapted to drive a selected bit line of the WBL and the WBLC to a voltage uplevel below a first supply voltage and shut off the drive to the selected bit line when the selected bit line reaches the uplevel. The write driver logic is further adapted to drive an unselected bit line of the WBL and the WBLC to a downlevel, in conjunction with the driving of the selected bit line to the uplevel, where the downlevel is a second supply voltage lower than the first supply voltage.

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Rochester, MN, United States of America

Derick Gardner Behrends