Gopro, Inc.

Apple Inc.

Derek Yap

Richard Gioscia

Joshua P Davies

Evan L Coons

Seungheon Lee

Ron Alan Hopkinson

William Francis Leggett

Bartley K Andre

Mikael M Silvanto

Matthew Phillip Casebolt

Eric Andrew Knopf

Joshua T Druker

Charles A Schwalbach

Houtan R Farahani

Christiaan A Ligtenberg

Justin Derry Crosby

Gavin J Reid

Jay S Nigen

Richard H Tan

Seung Heon Lee

Stephanie Russo

Benjamin Parfitt

A multi-configuration mounting system has been disclosed. The multi-configuration mounting system comprises an adapter configured to couple to a first device, and a receptacle defining an opening within a surface of the adapter. The receptacle receives a tab of a clip housing that secures a second device, thereby forming an interference fit between the tab and the receptacle to couple the second device to the first device via the adapter.

Multi-configuration mounting system

Camera housing

A removable assembly for quickly inserting and removing a mass storage device from a compartment situated on the case of a portable computing device is described. The removable assembly is made of a mass storage device, a bracket which serves as a carrier for the mass storage device, and a metal plate. In some embodiments, the mass storage device is a solid state drive (SSD) card. The bracket is a single-piece plastic structure that is deflected for snap insertion into the compartment and snap removal from the compartment. The metal plate conducts heat from the solid state drive (SSD) card to prevent the SSD from overheating.

SSD (solid state drive) related features of a portable computer

Camera frame

The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

Solid-state drive with passive heat transfer

Electronics package

Systems and methods for reducing the effects of stray magnetic flux are provided. For example, an electronic device can employ the system and can include a first audio component configured to have a first acoustic phase and a first magnetic phase. The electronic device can also include a second audio component configured to have the first acoustic phase and a second magnetic phase that is opposite the first magnetic phase. The first audio component can be positioned with respect to the second audio component, such that any stray magnetic flux from the first audio component enters the second audio component during operation of the first and second audio components.

Systems and methods for reducing stray magnetic flux

Growing community of inventors

San Carlos, CA, United States of America

Derek Yap