Other

Wave Computing, Inc.

Audible Technology, LLC

Derek William Meyer

Aaron T Emigh

Christopher John Nicol

A combination of memory units and dataflow processing units is disclosed for computation. A first memory unit is interposed between a first dataflow processing unit and a second dataflow processing unit. Operations for a dataflow graph are allocated across the first dataflow processing unit and the second dataflow processing unit. The first memory unit passes data between the first dataflow processing unit and the second dataflow processing unit to execute the dataflow graph. The first memory unit is a high bandwidth, shared memory device including a hybrid memory cube. The first dataflow processing unit and second dataflow processing unit include a plurality of circular buffers containing instructions for controlling data transfer between the first dataflow processing unit and second dataflow processing unit. Additional dataflow processing units and additional memory units are included for additional functionality and efficiency.

Communication between dataflow processing units and memories

In some embodiments, techniques for audio processing may include receiving a first characterization of a first audio device, including a first audio parameterization that includes at least one parameter relating to characteristics of the first audio device; receiving a second characterization of a second audio device, including a second audio parameterization that includes at least one parameter relating to characteristics of the second audio device; determining a processing parameterization that includes a combination of a plurality of audio processing factors, wherein the audio processing factors include the first characterization and the second characterization; receiving a first electronic audio signal, as the input signal; generating a second electronic audio signal, as the output signal, wherein generating the second electronic audio signal includes processing the input signal using the processing parameterization; and providing the output signal via an electronic audio output interface.

Synthesized audio parameters

In some embodiments, a tetrahedral subwoofer enclosure includes a substantially triangular first face, second face, third face, and fourth face, a first corner at an intersection of the first, second and third faces, a second corner at an intersection of the first, second and fourth faces, a third corner at an intersection of the first, third and fourth faces, a fourth corner at an intersection of the second, third and fourth faces, wherein an angle between the first corner and a midpoint between the third corner and the fourth corner, having the second corner as its vertex, is substantially ninety degrees, wherein an angle between the third corner and the fourth corner, having the second corner as its vertex, is substantially ninety degrees, and a subwoofer driver attached to the third face, having a free air resonant frequency less than one hundred Hertz.

Trirectangular tetrahedral subwoofer

In some embodiments, a subwoofer enclosure includes a substantially triangular first face, second face, third face, and fourth face, a first corner at an intersection of the first, second and third faces, a second corner at an intersection of the first, second and fourth faces, a third corner at an intersection of the first, third and fourth faces, a fourth corner at an intersection of the second, third and fourth faces, wherein an angle between the first corner and a midpoint between the third corner and the fourth corner, having the second corner as its vertex, is substantially ninety degrees, wherein an angle between the third corner and the fourth corner, having the second corner as its vertex, is substantially ninety degrees, and a subwoofer driver attached to the third face, having a free air resonant frequency less than one hundred Hertz.

Growing community of inventors

Truckee, CA, United States of America

Derek William Meyer