Huntsman Advanced Materials Americas LLC

Derek Scott Kincaid

Dong Le

David L Johnson

Dong Wang

Bradley Rechichar

Hui Zhou

Tao Tao

Frank Tran

Lorenzo Neil Petway

Ronald C Smith, Jr

K P Subrahmanian

Surendar N Kaul

Madhi Ghazizadeh

Lorenzo Petway

David Lanham Johnson

The present disclosure provides a curable resin system containing an alkylated glycidyl amine and a phenylindane diamine. The curable resin system may be cured at relatively low temperatures to produce cured products having desirable physical, thermal and chemical properties for use in various applications including composites for the aerospace and automotive industries.

Curable resin system

A curable epoxy system useful in the production of composites capable of being used in various industries, including, for example, the aerospace industry. In particular, the present disclosure relates to a curable epoxy system comprising (i) an epoxy component selected from bisphenol C diglycidyl ether, one or more derivatives of bisphenol C diglycidyl ether, and combinations thereof, and (ii) 9,9-bis(4-amino-3-chlorophenyl)fluorene.

Curable epoxy system

A curable system containing a benzoxazine and a benzothiazole sulfenamide. The curable system may be catalyzed at temperatures generally used to cure multifunctional epoxy resins yet exhibits improved pot-life and processing times and provides a cured article that exhibits acceptable thermo mechanical properties.

Benzothiazoles as latent catalysts for benzoxazine resins

The present disclosure provides a curable composition containing a benzoxazine, reactive diluent and a soluble polyimide. The curable composition, upon curing, renders an article having well balanced thermal, chemical and mechanical properties and may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.

Curable benzoxazine compositions

The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130&#xb0;-140&#xb0; C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

Benzoxazine low temperature curable composition

The present disclosure relates to UV resistant multi-component structural adhesive systems that are substantially free of aromatic epoxy resins, Also provided are methods of preparing the multi-component structural adhesive systems and methods of bonding substrates together with such adhesive systems.

UV resistant epoxy structural adhesive

The present disclosure relates to a curing agent for a curable resin which is a reaction product obtained from the reaction of a liquid epoxy and a polyamine component. The curing agent may be used as part of a two component curable system for the curing of unmodified epoxy resins.

Curing agents providing a low ratio of thin-film cure time to gel time

The present disclosure relates to a water-based amine curing agent which is a reaction product obtained from the reaction of an aqueous epoxy resin dispersion and a polyamine component. The water-based amine curing agent may be used as part of a two component coating system in the curing of modified or unmodified liquid or pre-dispersed curable resin.

Water-based amine curing agents for curable resin systems

The present disclosure provides a method for producing a benzoxazine compound by reacting a bi-functional phenol with formaldehyde and a mono-functional amine in the presence of a solvent system containing an apolar solvent and a polar aprotic solvent. Once formed, the benzoxazine compound may be precipitated from the reaction solution and dried to form a benzoxazine compound in powder form.

Method for producing benzoxazine compounds

Epoxy resin compositions contain (i) a potyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or a mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.

Epoxy resins with high thermal stability and toughness

Epoxy resin compositions contain (i) a polyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.

Growing community of inventors

Spring, TX, United States of America

Derek Scott Kincaid