International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Derek Ian Schmidt

James Scott Womble

Richard M Barina

Daniel Paul Kelaher

Mark Edward Steinke

Vinod Kamath

Timothy Andreas Meserth

Tony Carl Sass

Chunjian Ni

Gregory Mark Bennett

Mark S Bohannon

Eric Alan Eckberg

Jason Aaron Matteson

Paul Andrew Wormsbecher

Brian Michael Kerrigan

Michael Raymond Miller

Gerhard Ingmar Meijer

Jonathan Randall Hinkle

Jeremy Scott Bridges

Pat Gallarelli

Robert Mark Lindsay

James Robert Drake

George M Moorefield, Ii

Michael Dudley French, Jr

Paul Jeffrey La Rocca

James Scott Wombie

According to one embodiment, a method for placing an adapter card on a system board of a computer system includes, aligning a tool having an adapter card secured therewith to a slot on a system board of a computer system using a positioning member, and seating the adapter card into the slot on the system board. The tool includes a carrier for supporting the adapter card, at least one lower retaining member extending from a lower portion of the carrier for securing the adapter card to the carrier, at least one upper retaining member extending from an upper portion of the carrier for securing the adapter card to the carrier, and the positioning member coupled to the carrier.

Internal PCI adapter card carrier

A system includes a chassis, a plurality of nodes, a coolant distribution unit (CDU), and one or more air movers. The chassis includes multiple node bays, a CDU bay, a coolant supply manifold with an inlet in the CDU bay and an outlet in each node bay, and a coolant return manifold an inlet in each node bay and an outlet in the CDU bay. Each node is received into a node bay with an internal heat exchanger connected between a coolant supply and return manifolds. The CDU is received in the CDU bay and includes an air-to-coolant heat exchanger in fluid communication between the supply and return manifolds, and a pump for circulating a coolant through a coolant loop. The one or more air movers force air across the air-to-coolant heat exchanger of the CDU.

Coolant distribution unit for a multi-node chassis

A system, according to one embodiment, includes a first end having several first contacts configured for coupling with a circuit board, a second end oriented about orthogonal to the first end, and a plurality of leads connecting the first and second contacts. The second end has a plurality of second contacts configured for coupling directly with a card edge of an electronic device. The orientation of the second end relative to the first end is fixed. A system, according to another embodiment, includes a circuit board, a plurality of such connectors.

Orthogonal card edge connector

An apparatus includes a rigid structure having first and second collars, a quick connect connector having first and second shoulders, and a spring biasing the connector toward an extended position with the first shoulder against the first collar and the second shoulder against the second collar. The first collar and the first shoulder form an inwardly and rearwardly angled contact surface there between, and the second collar and the second shoulder form an inwardly and rearwardly angled contact surface there between. The connector is centered in the first and second collars unless acted upon by a force overcoming the spring and pushing the connector to a retracted position with the first and second shoulders out of contact with the first and second collars. When retracted, the connector may adjust its position longitudinally, vertically, laterally or angularly to facilitate coupling with a mating fixed quick connect connector.

Blind docking apparatus to enable liquid cooling in compute nodes

A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

Liquid cooling of multiple components on a circuit board

An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights.

An apparatus includes a memory module connector assembly physically secured along an edge of a printed circuit board. The printed circuit board includes a first plurality of contacts on a first surface of the printed circuit board and a second plurality of contacts on a second surface of the printed circuit board. The memory module connector assembly includes a first edge connector socket for receiving a first memory module, a second edge connector socket for receiving a second memory module, a first plurality of electrical leads electrically connecting contacts within the first edge connector socket to the first plurality of contacts on the first side of the printed circuit board, and a second plurality of electrical leads electrically connecting contacts within the second edge connector socket to the second plurality of contacts on the second side of the printed circuit board.

Memory module connector assembly

An adjustable riser cage retains varying length adapters. For example, the adjustable riser cage may support a short adapter card, a &#xbe; length adapter card, or a long adapter card. The adjustable riser cage includes a riser portion and an extension portion. The riser portion includes one or more guidance features and a plurality of first retention members. The extension portion is slide ably supported against only the one or more guidance members, and includes a second retention member configured to engage with a particular first retention member depending upon a length of the adapter card to be supported. The adjustable riser cage may be installed into a larger electronic system having a plurality of electronic components. The adjustable riser cage allows for increased access to the electronic components because the extension portion is not supported by external or non-integral support features that may block access to the electronic components.

Adjustable riser cage for varying length adapters

Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.

Liquid-cooled memory system having one cooling pipe per pair of DIMMs

A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

User-serviceable liquid DIMM cooling system

In one general embodiment, a product includes a metal panel having a main portion and a knockout portion formed therein and detachably coupled thereto, wherein the knockout portion includes at least one member insertable in one or more apertures in the main portion for allowing re-coupling the knockout portion to the main portion after detachment therefrom. In another general embodiment, a product includes a metal panel having a main portion and a knockout portion formed therein and detachably coupled thereto, wherein the main portion includes at least one member insertable in one or more apertures in the knockout portion for allowing re-coupling the knockout portion to the main portion after detachment therefrom.

Replaceable knockout part in a metal panel and systems and methods thereof

A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Liquid-cooling memory modules with liquid flow pipes between memory module sockets

A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.

Tool for installation and removal of semiconductor device

A product according to one embodiment includes a metal panel having a main portion and a knockout portion formed therein, the knockout portion being coupled to the main portion by at least one web of metal contiguous to both the knockout portion and the main portion, the at least one web allowing detachment of the knockout portion from the main portion, wherein the knockout portion includes at least one member insertable in one or more apertures in the main portion for allowing re-coupling the knockout portion to the main portion after detachment therefrom.

Method of making a replaceable knockout part in a metal panel and systems thereof

An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.

Growing community of inventors

Raleigh, NC, United States of America

Derek Ian Schmidt